Electronics Forum: about (Page 931 of 1198)

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting

Agilis Feeder Inserts

Electronics Forum | Wed Jan 20 17:16:36 EST 2010 | grantf

While on the topic of feeders I would like to ask a question about the Mydata Tube or stick feeders. Due to a shortage of metal forks for the tube feeders we are forced to improvise and use what ever size of fork is available. This is done by notchin

Mydata My100 or Siemens D1?

Electronics Forum | Mon Jan 25 00:56:38 EST 2010 | sparrow

Hello, Mydata p&p machines are built for high mixed and low/mid volume production, so if you talk about very low volume - no doubt, mydata is what you can use. You can consider 2 models for your application - MY100SX or MY100LX, depending on the min

Toyota sticking pedals recall is a smokescreen

Electronics Forum | Mon Mar 01 10:36:55 EST 2010 | patrickbruneel

Loco, Since Dave didn't respond i will. We shouldn't forget that even when using tin/lead solder the boards and components are still lead free. Parts that are not completely wetted by the tin/lead solder still have the potential for tin whiskering a

Selective Solder Equipment

Electronics Forum | Thu May 20 18:14:53 EDT 2010 | geocep

Process Flux is AIM 275. Tip tinning flux is Superior 75. We have gotten dual nozzles in the 6mm & 9mm sizes we run. We can get a nozzle to run about 8 hours. Every night we clean all used nozzles with a scouring pad, apply Superior 75 flux with

PCB Surface Question - Picture attached

Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef

You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam

Quad 4C place problem

Electronics Forum | Wed Mar 31 06:08:45 EDT 2010 | miroyu

Hi everyone ! I started to program quad 4C for the first time and have some problems. First, board detection LED and proximity Led (on the front panel) are not lightning whatever I do! Second problem is I teach machine board size, nozzle locations

Multilayer PCB X-ray inspection

Electronics Forum | Tue Apr 06 14:45:52 EDT 2010 | stepheniii

You would be suprised what you can see with even a simple Xray machine. The engineers upstairs wanted to see if the xray could confirm there was an open via on a thin dense board with several layers. I thought (but didn't say) no way. But with carefu

YesTech YTV-2000 Question

Electronics Forum | Mon Apr 05 09:33:42 EDT 2010 | flanz

Hello. I'm new to the group and would like to ask a question about a YTV-2000 that I have. Question is - Could someone explain why my Yestech 2000 has a hardtime with calibration? What happens is that I run calibration before I start a new board.

Unusual solderability issue

Electronics Forum | Mon Apr 19 10:52:05 EDT 2010 | esca

Hi, if you want to verify the gold contamination, is mandatory to use the XPS and FTIR analysis, but is difficult think about a gold contamination from 3 different manufacturers. Do you have cleaned the PCBs after an erroneous screen process ? If no


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