Electronics Forum | Sat Jun 12 08:50:41 EDT 1999 | Dave F
| I am trying to find out as much information as possible relating to conductive inks. | | If anyone out there is using them please give some advice. | | 1) How are you curing the ink? | 2) What type of substrates are you using and who supplies
Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F
| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n
Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
Electronics Forum | Tue Jun 08 14:16:49 EDT 1999 | Dave F
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup
| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process
Electronics Forum | Thu May 06 18:06:43 EDT 1999 | JohnW
| | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | Thank you vey much. | | | | rdgs... | | | Typical depends on the processes you're developing. | | Key factors in my experience are flux type and requi
Electronics Forum | Thu May 06 18:07:59 EDT 1999 | JohnW
| | | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | | | Thank you vey much. | | | | | | rdgs... | | | | | Typical depends on the processes you're developing. | | | | Key factors in my experience are f
Electronics Forum | Tue May 18 03:58:26 EDT 1999 | stefano bolleri
Cliff, thank you for the explanation. Yes, I actually have my browser set to not accept cookies. I have done that by purpose, and I'm reluctant to make a change to this setting, even if it adds a functionality (= post items onto the PCBCE Mart). So
Electronics Forum | Tue Apr 27 05:10:34 EDT 1999 | Earl Moon
| Which is the preferred method for soldering a bga, adding solder paste or not? Solderpaste manufacturers say to add solder while the rework station manufacturer's say it's not necessary. | Paste is preferred by not necessary. Our studies, conduct
Electronics Forum | Sun Apr 25 11:30:12 EDT 1999 | Earl Moon
| Hello all, | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profi
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