Electronics Forum: add (Page 96 of 164)

Epoxied Parts Falling Off

Electronics Forum | Mon Feb 24 10:21:29 EST 2003 | ryanm

Just an update on my problem. I spoke to Loctite and they had very few solutions. One thing they suggested to try was to add a thirty-second soak time at 150 degrees to my reflow profile. The problem with that is ramp-soak-spike profiles doesn�t s

SMT Component rotation problem

Electronics Forum | Thu Feb 27 14:02:26 EST 2003 | russ

Genny you are right on with the differences between suppliers/packaging etc... I am a CEM and you are correct that we pay no heed to cad rotations from our customers/designers. A.V.L./manufacturers P/Ns information specifies orientations and such.

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe

Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s

Print-Glue-Wave process

Electronics Forum | Thu Mar 13 15:13:17 EST 2003 | ruggi

That's a good idea...and to add on to it, you could wash after the wave, too--it really doesn't matter. A question about this though--unless your Customer specifically requires "clean", no-clean flux whether it's ugly or not, is permitted by IPC,

Skewed transistors

Electronics Forum | Mon Apr 21 16:39:50 EDT 2003 | k_h

You might try reducing your solder paste volume. To much solder paste gives the part a pool to float in, nullifying the positive effect of surface tension. I use an aperture on stencil for the heat sink which is 5mils reduced on each side and a 25mil

Component Overturn

Electronics Forum | Thu May 08 09:00:03 EDT 2003 | stefwitt

I like to find out more about your feeder manufacturer. Known problems: If the cover tape peel back is located in the pick up window, the tape may lift the component out of the pocket and when the component falls back it could be inverted. The co

Lead Free soldering profile for SMT

Electronics Forum | Fri Jun 06 07:23:18 EDT 2003 | johnw

Hi Kevin, the profile doesn't actually qualify something as lead free or not it's purely the Pb content of the assembly that does this. Currently the understanding of the limitations of the lead in the jont is 0.1% by weight or less. So as long as y

Wave soldering profiling

Electronics Forum | Wed Jun 11 10:27:33 EDT 2003 | caldon

Frank-In addition (Dave gave some good scoop) we use a Pyrex Glass board to run through the wave. This is useful as you can see through the board .....you can watch the flux coverage, preheat, and Wave (be it Chip, lamda, or??) as it goes through the

Bga replacement on ENIG Fabs.

Electronics Forum | Mon Jul 28 08:54:52 EDT 2003 | davef

You are 100% correctomundo about ENIG. When it's good it's good, BUT when it's bad, you just want something else. You know you have black pad, when you see parts falling from the board. First, there is not perfect solderability protection. Second

Assembly Revision Control

Electronics Forum | Tue Sep 09 11:41:19 EDT 2003 | slthomas

You can always add a second level of control. We used a document that lists all configuration codes that reflected these types of changed. For instance, code 001 reflects Dwg. Rev. A, and ECO A1 and DVR 4234. Code 002 reflects Dwg. Rev. A, and ECOs


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