Electronics Forum: advances (Page 141 of 243)

Circuit Cam Documentation software

Electronics Forum | Wed Nov 01 09:59:29 EST 2006 | Scott

We are looking at buying Circuit Cam documentation software. The documentation side is our primary need with a requirement to document from start to finish including box build. I have read past posts that were complimentary of the software. Has an

It's neccessary to dry PCBs?

Electronics Forum | Fri Nov 24 11:01:13 EST 2006 | joseluis_amper

Hello. I don't know if is neccesary to dry all pcbs before gegin the proccess, or depend of the type of pcbs. It's neccessary to bake the pcbs and components?, only components?.... What proccess do you recomend?. I read that is convenient bake the pc

Strange empty ball on chip component after reflow

Electronics Forum | Thu Nov 30 08:09:19 EST 2006 | INGE

Hi everybody, The matter is this: after reflow, on top side leads of chip components (resistor 0805)appear some empty balls of solder. In some cases this thing is only on the lead and the solder joint seems good, in other cases this empty ball is als

SMT PRODUCTION ISSUES

Electronics Forum | Fri Dec 01 06:31:53 EST 2006 | CHITRA K

We use SMBJ5.0A - D0214A package component in our products.During production recently we have identified a seroius problem. The problem is, After reflow soldering the impedance becomes more / lesser and due to which the product does not work since th

Overprint, solder flow back

Electronics Forum | Tue Dec 05 03:39:39 EST 2006 | pavel_murtishev

Good afternoon, Due to problems with power connector soldering I have to overprint paste on pads for this connector. Stencil thickness is 125um and I cannot make it thicker. Area ratio of chip resistor assemblies limits stencil thickness to 125um. R

Cable assembly

Electronics Forum | Thu Dec 21 13:06:16 EST 2006 | vortex

Hi we are a small contract manufacturer in need of a one time use cable crimping tool DF13-TB2630HC. We only have 3 (4) contact wires to make which will be plugged into another assembly. The p/n we are trying to crimp is DF13-2630SCFA. If you have th

Manufacturing and test room cleanliness

Electronics Forum | Wed Mar 12 18:30:22 EDT 2008 | genaro_silvera

Hello Steve: I work at Navico, a company that makes GPSs and Sonars among other products for recreational fishing. I want to know if our SMT, Thru-Hole and Final Assembly areas need to be in a cleanroom environment? I've worked in another companies

Printing off contact

Electronics Forum | Tue Feb 20 06:05:10 EST 2007 | mk

Thanks to all for the info. The ideas to correct the situation are all excellent and if we see any more boards from this source with this condition we will know what to do now. In the end however, the real questions we are trying to answer are, 1.I

simple doubt about reflow profile

Electronics Forum | Fri Feb 16 13:43:07 EST 2007 | ck_the_flip

Hi Darby, Where did you get the info. that cooling rate is not-as-critical for lead-free? I'm not doubting you, and I actually want this to be the case. We don't have chillers on our ovens, and on fast profiles, we only achieve 2 to 2.5 deg. / s c

Mirtec MV-3 3D desctop AOI system

Electronics Forum | Wed Feb 21 09:36:10 EST 2007 | hanza

Hello, We are planning to buy a desktop AOI system and were able to experiment with a Mirtec MV-2 system. Results were pretty good, except for some types of solder inspection. I am wondering if anyone has some experience with the Mirtec MV-3 (3D 5-


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