Electronics Forum | Fri Nov 30 14:36:05 EST 2007 | mulder0990
I am looking for any data or anyone that has a STU style qp feeder. My company is looking for one and I am having little luck finding any data on this style of feeder. Thank You in advance.
Electronics Forum | Fri Dec 21 09:26:48 EST 2007 | realchunks
Paper Advance = CONTINUOUS Index = 3 Prime = 3 Vac = ON Vac Freq = 1 VAc Speed = 3
Electronics Forum | Thu Dec 27 02:57:49 EST 2007 | gersla
17 mm x 17 mm or any stacked die package). What is stacked die package? Can you send me a picture of such a component? Thank you in advance,
Electronics Forum | Wed Dec 19 15:23:32 EST 2007 | arun2382
Hi, How do single pass and double pass stencil printing compare? Is one preferred to the other? Any risks associated with double pass stencil printing? thanks in advance -Arun
Electronics Forum | Wed Jan 16 15:06:12 EST 2008 | jdengler
Try Bill Lockwood at SMT Research. He may have a pdf version of the advanced maintenance book. bill@smtresearch.com Good luck, Jerry
Electronics Forum | Wed Jan 30 21:56:47 EST 2008 | rayjr1491
On the DEK Horizon there are two options for underside cleaning one is a foam cleaner and paper cleaner that advances. The Foam cleaner cleans using liquid but does not increment and foam piece and can be washed but there are still contaminents. We h
Electronics Forum | Thu Mar 27 07:54:41 EDT 2008 | stevezeva
At what point do we just say enough is enough!! Screw the EU! If they want to continue down this path then let them, and the rest of the world will continue to advance and reap the benefits of technology... Geeze, this is getting 'friggen rediculous
Electronics Forum | Thu Mar 27 15:19:07 EDT 2008 | ck_the_flip
Will clay, rock, and paper provide sufficient signal carrying capabilities without degrading signal strength or transmission speed, and further, will these materials exceed tensile strengths of traditional "metallurgical" solder joints? DaveF? Patr
Electronics Forum | Thu Apr 03 17:25:49 EDT 2008 | alexs
Hi All, I have some question about expired solder paste. What would be some of the effects regarding assembly quality. Is there any changes in flux composition toward the end of shelf life? Thanks in advance for any replies.
Electronics Forum | Thu May 01 09:11:28 EDT 2008 | ck_the_flip
Me too! Last time I evaluated these, voiding was a big problem. I wonder if the technology on these has advanced at all. Look forward to the forum responses (*rolling my eyes like a sarcastic Rodney Dangerfield*)
