Electronics Forum | Thu Jul 01 14:47:10 EDT 1999 | Tony
| | | My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side
Electronics Forum | Fri May 28 08:15:02 EDT 1999 | Clifford Peaslee
It is taking more time than we thought to set up the server. So, SMTnet will move this weekend or Monday, after the server is completely setup. Thanks, Cliff
Electronics Forum | Tue May 25 07:03:34 EDT 1999 | Milan Z.
After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) Where is the problem? Thanks in advance!
Electronics Forum | Mon May 10 10:08:16 EDT 1999 | Rich Taylor
Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not?
Electronics Forum | Mon Apr 12 18:33:35 EDT 1999 | Earl Moon
Thanks all you kind and knowledgeable folks. I no longer will be participating in this forum. After careful consideration, I have come to the conclusion registration, in the manner required to participate in what was an open forum, is not my bag.
Electronics Forum | Mon Apr 12 22:04:45 EDT 1999 | Jeff Sanchez
| Thanks all you kind and knowledgeable folks. I no longer will be participating in this forum. | | After careful consideration, I have come to the conclusion registration, in the manner required to participate in what was an open forum, is not my
Electronics Forum | Fri Mar 26 19:32:05 EST 1999 | Martin Dunning
I am a student doing a project on rework os BGAS and CSPS and Im looking for information on it especially rework of csps Has anyone got x-ray images of csps after rework or of BGAS to show csps with solder balls Appreciate any help Urgent!!!!
Electronics Forum | Mon Mar 15 10:43:06 EST 1999 | grevald
After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So we had to go back to No-clean. Any idea why voids
Electronics Forum | Mon Mar 15 08:06:46 EST 1999 | Ron Lahat
After rmoving a BGA (plastic)to correct unexplained shorts I installed another BGA using flux only. Checking on an X Ray machine and found two shorts. can anyone give a good explenation ? Thanks Ron
Electronics Forum | Sun Jan 24 19:53:54 EST 1999 | Steve Gregory
| It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not come
