Electronics Forum: after (Page 231 of 696)

Pad Design

Electronics Forum | Mon Apr 16 12:31:27 EDT 2001 | mparker

If, after all the good advice already given, the engineer insists on following his wacky design, you may still be able to influence some success. First you have the fab house plug the via holes with solder then you make sure that the bottom side of

Solder wetting test for PCB's

Electronics Forum | Mon Apr 23 14:02:26 EDT 2001 | relensky

I am looking for a repeatble method to determine the quality of solder wetting to a PCB. I would like something that I can perform in-house, at low cost, with reliable results. My goal is to test the wetting on white-tin PCB's, after repeated reflo

Re: Technical Articles

Electronics Forum | Mon Dec 18 15:01:02 EST 2000 | Charles Harper

I suggest considering a booth or a newsletter,or presenting a paper at leading SMT related conferences such as APEX,EtroniX,IPC Printed Circuits Expo,etc-or maybe publishing an article in a couple leading journals.I would be glad to discuss ideas in

Re: Lead-Free Alloy composition used for leaded IC Packages

Electronics Forum | Tue Aug 22 11:23:40 EDT 2000 | Dr. Ning-Cheng Lee

Plating houses seem to exhibit various results. Unacceptable Ni oxidation levels appear to be related to poor Pd plating processes. Ni oxidation can occur at 3 process stages: 1) prior to the Pd being applied (Ni already oxidized) 2) during the p

Solder balls

Electronics Forum | Mon May 07 17:59:07 EDT 2001 | davef

One thing I forgot to add about the globs of solder on your bottom side SMT components after wave soldering: The excess solder is likely reducing the reliability of these components, because of the difference in CTE betweeen the ceramic base on the

Info on OSP PCB�s

Electronics Forum | Wed Apr 23 15:17:11 EDT 2003 | Robert

Let me see if I got this right. The OSP in un-plugged vias will break down after subsequent reflows and washes which can result in oxidation. Question: Is there any paper covering oxidation and reliability on such a condition. We are averaging .0007

MS Level 6

Electronics Forum | Thu Jun 21 14:36:06 EDT 2001 | dason_c

DaveP, I never see the Level 6 component, can you describe what is the package look like, ie high pin count PBGA, component thickness? DaveF, if we can store the components in the dry environment say below 10%, can we stop the floor life clock after

Equipment Heat Load

Electronics Forum | Wed Jul 04 15:13:17 EDT 2001 | davef

Dunno, but our a/c cats asked us the same question a cuppla of years ago and we couldn't figure-out what they were talking about. So to not get wrapped around the axial, we defined our heat sources in terms of time, temperature, durations, etc. Thr

Recommendations for ultrasonic cleaning solution

Electronics Forum | Wed Jul 11 18:42:35 EDT 2001 | Darby

As I mentioned in the previous string we are happy with Electrolube "SSS". The guy who built our ulrasonic cleaners recommended it and it works very well. You don't have to change tanks or machines for a switch from paste to adhesive. It doesn't leav

Solder Paste

Electronics Forum | Thu Jul 19 08:04:04 EDT 2001 | dahsr

I have a sealed and refridgerated 350g jar of solder paste (water soluable flux). According to the label it expired July 1st. 2001 after the 6 month shelf life. Can this be used? Why or why not? What is the relevance of the expiration date? Can I re-


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