Electronics Forum | Tue Oct 05 13:30:23 EDT 1999 | Debbie Alavezos
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Sep 29 04:30:27 EDT 1999 | ROBERT
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Sun Sep 26 11:54:06 EDT 1999 | Earl Moon
| i had a problem here, during the wave soldering process, we apply a water soluble mask on the gold finger to protect it from contamination. But after washing, there is still some mask left on the gold finger. | Can anyone pls advise is there any pa
Electronics Forum | Fri Sep 24 09:49:53 EDT 1999 | C.K.
Hi Folks: We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. The bridging is happening after coming out of reflow...one last thing t
Electronics Forum | Thu Sep 23 12:42:02 EDT 1999 | Bob Barr
Dear Administrator, On 9/25, a forum user named Seli posted a question titled "Electronic Manufacturing on the Beach". Out of 11 responses to his posting, exactly one had anything to do with his question. The other 10 were completely off topic. P
Electronics Forum | Fri Sep 17 15:15:10 EDT 1999 | Dave F
snip | | So Ryan have we just gotten back from lunch with someone? | | Yes, and for a rookie, it was mildly confusing. I'm as of recent, a regular "reader" of the forum and thought it might be (and it is!!!) a good place to get other opinions. |
Electronics Forum | Mon Sep 13 11:23:41 EDT 1999 | Bing Feng
Hi, Recently encountered missing components problem at the SMT process. Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked the pick
Electronics Forum | Sun Sep 12 09:40:04 EDT 1999 | Wayne S.
hello having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would they do that
Electronics Forum | Thu Sep 02 15:50:30 EDT 1999 | R Scheller
Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? What I'm really after is anything describing how close a screw/washer/nut combination which
Electronics Forum | Fri Sep 03 14:20:38 EDT 1999 | David
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | You must have been in the same meeting I was in earlier today. We are currently having some opens on BGAs. The problem joints are all on the perimeter of
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