Electronics Forum: after (Page 491 of 696)

Problems with .45 mil ball diameter BGA....

Electronics Forum | Fri Apr 29 17:49:22 EDT 2005 | Woodsmt

I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r

Problems with .45 mil ball diameter BGA....

Electronics Forum | Fri Apr 29 17:49:26 EDT 2005 | Woodsmt

I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r

UP1500 Frame Sizes?

Electronics Forum | Tue May 03 08:11:02 EDT 2005 | jh0n!

I appreciate the detailed reply. However, I had tried dimensioning the stencil to everything imaginable, including the correct/measured dimensions. Interestingly enough, after loading a new stencil into our adaptor, I had no errors with the new pro

Selective soldering justification

Electronics Forum | Mon May 09 17:27:46 EDT 2005 | cmiller

They are expensive so you need to have a lot of jobs that take a long time to hand solder or have a ton of masking. Also look at bottom side wave soldering, if you are having a lot of defects, the selective will allow you to solder both sides in surf

BGA & QFP post reflow inspection

Electronics Forum | Wed May 04 19:09:52 EDT 2005 | russ

Can you not just check the part when it is on line and being loaded into the machine? You should only need to check this once. Verify your setup to the bom and not your assembled boards to the BOM. Correct setup and program = correct boards. More

TH Crystals

Electronics Forum | Wed May 11 06:22:33 EDT 2005 | rlackey

The above suggestions look to be the most likely, however on the off chance: Going back a decade we saw damage to crystals & resonators due to induced harmonics from ultrasonics (usually in the wash). Some fluxer systems use ultrasonics (I think

Machine won't change nozzles

Electronics Forum | Mon May 16 11:45:35 EDT 2005 | PWH

Agree with PDE. We have two GSM's and we get this error often. Palm down e-stop when you get this error message. Machine will drop nozzle bank down after doing some segment repairs. Open covers and make sure nozzles are seated in reference to ali

A.O.I recommendation

Electronics Forum | Mon Jun 20 03:37:43 EDT 2005 | MMunos

We have 3 inline Yestech systems in our facility. One system being used pre reflow for paste inspection and the other two for parts and solder. The systems work great for paste inspection (Better than what the sales guy told us). They are also very g

A.O.I recommendation

Electronics Forum | Wed Jun 22 19:43:14 EDT 2005 | BTaylor

I agree with steve. With so many vendors advertising to be the best, it is critical to have a "real time" demonstration on your product. Take a few good boards and a few defect boards along with the necessary data to the demo. Don't allow any prog

Dross produced, are we in or out?

Electronics Forum | Tue May 24 19:35:36 EDT 2005 | davef

Certainly, most often, the focus of pot analysis is directed at controlling impurities. Maintaining proper level of tin is important, also. When the portion of tin decreases: * Liquidous temperature increases. * Ability to wet decreases. * Solder c


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