Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve
Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On
Electronics Forum | Thu Dec 26 16:51:47 EST 2002 | davef
First, an earlier poster suggested using DI water. We are NOT excited about DI water with a NC fluxer, unless DI water is the proper flux thinner. Second, as you inplied, the maintenance steps you take should vary according to the amount of time th
Electronics Forum | Wed Apr 30 19:55:21 EDT 2003 | Mike Konrad
In all likelihood, you may not be leaving flux on the board rather you may be leaving saponifier on the board. Improper rinsing is a leading cause of cleaning related board failures. The problem with some inline cleaning systems (especially old o
Electronics Forum | Fri May 02 16:58:39 EDT 2003 | swagner
We have been building with flex circuits for nearly three years now, its an automotive product utilizing lead free paste, I will give you a few pointers. 1. Evaluate your supplier carefully, make sure you have some kind of stretch tolerance on the p
Electronics Forum | Mon Jun 23 04:00:43 EDT 2003 | Paul Cooper
Hi there There are a number of things worth considering when viewing bga's. Firstly, like any other solder joint that you have been inspecting for years, suface finish is critical. Secondly, and again like other joints shape is important. Now it may
Electronics Forum | Tue Jun 17 16:10:01 EDT 2003 | russ
First, what would you define as semi-automatic? For SMT production you might need a screen printer (these can be anything from full manual to full auto. The low end printers manual require each board to be aligned with a piece of mylar prior to p
Electronics Forum | Fri Nov 07 12:48:31 EST 2003 | rholland
I have seen in the last couple of months more boards with a white hazing under the solder mask. I ran a few tests on a board to determine the cause of the white hazing underneath the solder mask. First I confirmed, or at least I think I confirmed, t
Electronics Forum | Thu May 27 16:23:12 EDT 2004 | davef
Process Trials Procedures. Standard trials are often conducted on reflow ovens by production engineers during product assessment, machine approval or in process set-up. The following trials are also used by machine suppliers during equipment develop
Electronics Forum | Mon Jun 21 11:14:25 EDT 2004 | exmaintenanceleader
Dear Kanwaljit Singh, my opinion is following: 1)solderpaste type is ok - usual (alpha-metals has this problem inside the paste paste- holder problem) - what do the operator when production change -clean well the stencil holes!! no visible rest on
Electronics Forum | Thu Jul 01 10:24:31 EDT 2004 | davef
There is no specification for �Ion Chromatography for Ionic Cleanliness�. The performance of your product in your customer use environment determines the level that you select. The good part for you is that have at least one pole that you can put i
