Electronics Forum: after (Page 96 of 656)

Component Skew during Reflow Process

Electronics Forum | Wed Dec 11 10:25:46 EST 2019 | engmagana

Dear Ameen, We have proved to the customer than the solder fillet obtained after the solder reduction is enoug by bracking some parts and obtainig more than 200 Newtons before and after, the problem has deminish but not yet solved , next step is re

Issue with MYDATA MY19 "Transducers do not agree"

Electronics Forum | Wed Feb 12 14:14:42 EST 2020 | alvarez94

I am running a MYDATA MY19 machine.the problem is that the first 2 hours after turning on the machine it does not work throwing the following error: "transducers do not agree". After approximately 1 or 2 hours the machine starts working normally. T

Circuit cam and mydata

Electronics Forum | Wed Mar 25 14:46:08 EDT 2020 | stephendo

What about designators? Using gerbers to program a pnp machine was always a last resort to be done only after much complaining and begging for proper CAD data. Back in the day I used UniCAM to program a mydata. After getting it figured out it was eas

Solder balls on Cleaned process

Electronics Forum | Wed Oct 17 17:43:27 EDT 2001 | davef

2) Open time: A 15-minute queue between paste, place, and reflow SB fine, assuming humidity is not too great. 3) Wash temperature: Yes. A wash temperature of 130-140�F SB fine. 4) Reflowed board was left too long prior wash: Are you washing: * After

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Thu Nov 19 05:18:37 EST 2009 | prodivegsr

Hi All, Recently we are working on the conformal coating process using Humiseal chemical 1B73 and thinner 521. Bubbles on component body/joints are seen after gone through the IR Reflow Oven. During the conformal coating, only tiny bubbles seen af

When to use gloves

Electronics Forum | Sun Aug 13 00:15:58 EDT 2017 | deanm

We manufacture low volume, high reliability assemblies (class 3) that are conformal coated. Up until now we have been cleaning after SMT, then after through hole, then immediately prior to coating with test, formal inspection, etc. between cleaning p

Cleaning PCB After Soldering - How?

Electronics Forum | Wed Feb 22 03:29:09 EST 2017 | niki

Which is the best way to clean the PCB after > soldering? Is it good enough with IPA > (isopropyl) or with the Flux Remover > spray? However, we use a lead free solder wire > (3,5% flux inside the core) and after the > soldering its a visible we

Ekra E4 stencil wipe problem

Electronics Forum | Thu Sep 15 10:43:18 EDT 2016 | claudea2

Thanks to Bobpan we re connected our wipe system and all the air actuators work fine. I still have a problem with the cleaner fluid dispenser. It is not moving as it should to dispense the liquid when we do the command. I suspect the values in the c

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:19:53 EDT 1998 | Earl Moon

We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.

Performance estimation of SMT-assembly-Systems

Electronics Forum | Tue Aug 31 10:52:19 EDT 1999 | Andreas Foehrenbach

I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under differ

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