Electronics Forum: ags (Page 41 of 55)

problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 10:11:33 EDT 1999 | Dave F

| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 16:19:46 EDT 1999 | Kennyv

| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv

| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin

Re: HASL - again?

Electronics Forum | Fri Jun 18 12:36:52 EDT 1999 | Brian

What is the future of HASL with lead-free solders? I have grave misgivings as, even if it works properly (which I'm not too sure about), the alloy will have to match that used in the soldering process, or nearly so. No use using a Bi-containing HASL

Re: High Temp solder Paste

Electronics Forum | Fri May 14 00:34:22 EDT 1999 | Mike D.

| I need some pics or documentation on how a finish soldered joint looks like for SMT component. I have various people who supposedly says has knowledge with High Temp says my joint could look better. The joint looks shiny and great except for a grai

BGA Voiding Problem

Electronics Forum | Fri Apr 23 16:19:17 EDT 1999 | Todd

We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using a

Ceramic + Hi-temp solder

Electronics Forum | Wed Apr 21 12:03:59 EDT 1999 | Michael N.

I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is about

Re: Lead Free Solder used in BGA

Electronics Forum | Thu Jan 14 11:06:33 EST 1999 | Earl Moon

| | Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | | | K

Re: Conductive Epoxy

Electronics Forum | Thu Dec 03 11:11:01 EST 1998 | David Pinsky

| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in


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