Electronics Forum | Tue Apr 13 09:11:54 EDT 1999 | Dave F
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Tue Aug 22 15:34:55 EDT 2000 | Dr. Ning-Cheng Lee
An example of very low melting point Pb-free solder is 58Bi/42Sn. Different versions of this alloys have been tried, such as doping with various additives, in order to enhance the reliability further. Yes, Bi is one element which promises low mp for
Electronics Forum | Wed Jan 13 22:01:42 EST 1999 | Dave F
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | Jenna: We've used
Electronics Forum | Tue May 07 07:29:24 EDT 2002 | Yannick
Hi, I reaaly mean AG (Like silver) we was thinking about going with immersion gold butis a bit more expensive. we use a no-clean paste but in a few year( maybe 1-2) we suppose to change to a lead free. You said that with Immersion gold we
Electronics Forum | Tue May 07 07:38:13 EDT 2002 | ianchan
Hi mate, checked with one of our egg-brains in the factory (freakin' workaholic still around at this time of night), he tells me that Ag-based PCB finishings share rather similar reflow temperatures for normal Sn/Pb applications. this means (if he i
Electronics Forum | Tue May 28 17:50:20 EDT 2002 | myu
Hi, Everybody! I'm looking for a High-Temperature Solder Paste / wire: "Pb93WROL140.71454";or "00Z890"; J-STD-006 Solder Alloys Sn05Pb93Ag02B Sn% Pb% Ag% Solid C Liq C Solid F Liq F 5.0 92.5 2.5 280 284 536 543 It should meet IPC/J-ST
Electronics Forum | Thu Jan 15 09:40:47 EST 2004 | davef
Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24429 Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed ro
Electronics Forum | Wed Apr 20 18:13:32 EDT 2005 | greg york
With twenty five machines working with the LFB227/S on our little island it does seem to work well. Wetting is good compared to Tin/Copper and flow is comparable to 63/37. Biggest problem sticking 3 - 4 % Ag in a solder ignoring the patents and royal
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Wed May 02 04:04:18 EDT 2007 | greg york
What aload of rubbish - prove it, we have over 320 users in the UK alone using the SACP0307 solder with great results, and the biggest advantage they have is they can multiple source the solder not stuck to one company who has purchased the patent an
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