Electronics Forum: all (Page 1051 of 1504)

Re: Noclean soldering to gold

Electronics Forum | Mon Dec 06 12:37:57 EST 1999 | Russ

Christopher, in response to your request concerning if I have the same issue using OA fluxes the answer would be no. This finish works well with all of our current Water Soluble fluxes. As a note, I have done some further testing and so far it see

Re: PCB interval during reflow process

Electronics Forum | Fri Dec 03 03:58:12 EST 1999 | Wolfgang Busko

Hi Charly, For batch ovens there is no discussion. For inline loading interval depends on the oven you use, the amount of heat the PCB takes out of the zone and the capability of the oven to get it back in. The approximate time for the PCB to stay i

Re: Info. on Stencil cleaners

Electronics Forum | Mon Nov 29 16:36:31 EST 1999 | Curtis T.

Jason, We have been running both the high pressure and the ultrasonic washers for several years and there is no comparison. The ulrtasonic (smartsonic) does a great job on all the normal pastes, and when we changed part of our production to a new ep

Re: SMT Video

Electronics Forum | Wed Dec 08 17:45:38 EST 1999 | Dave F

Apologies to all who go beezerk (I'm one) when some maroon dredges-up an old thread (usually so they can babble in some thinly 'gised advert). I'm not doing that. I go more beezerk when we let someone's quiry go unanswered. Anyhow ... Francis: A

MSH Placement trouble

Electronics Forum | Fri Nov 19 07:45:59 EST 1999 | Claude Couture

Our Panasert MSH is randomly mixing up the parts placement. About 1 in 10,000 placement will be a wrong part. The wrong part may be any other part present on the feeder carriage. A chip resistor 0805 may be replaced by a minimelf or a sot-23. It is

Re: Double sided parts stuffing

Electronics Forum | Thu Nov 18 09:34:58 EST 1999 | Wolfgang Busko

Hi Will, it�s possible to use second reflow for second side components without glueing or use of different alloy solders. Although the first soldered joints become liquid during the second pass the parts will not fall off as long as their weight does

Re: Placement Equipment for 17 x 23 Backplanes?

Electronics Forum | Thu Nov 18 00:28:02 EST 1999 | Scott McKee

Use Mydata. I've built huge backplane boards, round boards, 1/4" thick boards, 1"X24" boards, 1"X1" boards, L-shapes boards; all without any carriers or tooling. If you buy a MY15 you can increase the board size to 5'X2' (60"X24")... As for ovens,

Re: How to qualify the solder flux of a new vendor?

Electronics Forum | Wed Nov 17 11:20:23 EST 1999 | Dave F

Hey Gyver: If you don�t mind (which you don�t have any choice about, because I�m going to do it anyhow, cause it�s MY word processor), I�m going to respond genericly, but still be directed to your question. Much of the following is paraphrased from

Re: Sorry, again, x,y digitizer and optical comparator

Electronics Forum | Mon Feb 18 04:49:55 EST 2002 | wbu

Hi NAMCo, I really don�t see any need in replying twice to an over 2 year old thread especially with no obvious technical content. A wrong phonenumber alone isn�t blantant and IMO no reason to open such a thread again and again ... that doesn�t help

Re: Solder Balls

Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup

Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us


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