Electronics Forum | Sat Dec 17 13:58:25 EST 2005 | bvdb
Jared, Thank you for the help. AFter following your advice we were able to get the display to say Jog L. However, pressing the UP or DOWN arrow or pressing the "F" key and the UP or DOWN arrow didn't do anything. The trays stay put. When we requ
Electronics Forum | Thu Jan 26 13:12:19 EST 2006 | Erik
We just bought a SM320 an will receive it next week. We had 3 days of user training this week and from my point of view it is a very good machine. Really easy to use and very fast and accurate. On our testboards we achieved *realistic* speeds of 10.0
Electronics Forum | Sat Dec 17 11:45:40 EST 2005 | DAM
You know, many SMD components have copper alloy leads and then a copper (or Ni) barrier on them. On the copper (or Ni) barrier there is the finish. Usually the finish is made of Sn\Pb (tin-lead), and if I solder with a Sn\Pb solder paste it's all rig
Electronics Forum | Wed Dec 21 12:12:44 EST 2005 | mmjm_1099
Hello all, I am a contract manufacturer and I got handed the project of looking up our parts and seeing what's lead-free and what's not. Well my question would be how is your purchasing dept handling this. I would like some input on this from alot of
Electronics Forum | Wed Jan 04 13:47:11 EST 2006 | russ
To answer your question it was mentioned that allowing the boards to cool slightly between reflow and wash may help this case to eliminate thermal shock from immediately going into colder water straight out of the oven with no cooling. In looking at
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york
Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Fri Jan 06 16:40:34 EST 2006 | Cmiller
We have a 3Z and a 3AV. We dont use the 3AV at all anymore and just took the 3Z out of service but we ran each for 4 years for at least 8 hours a day. We never had problems to the extent you seem to have. I did talk to someone a few years ago that sa
Electronics Forum | Tue Jan 10 14:04:38 EST 2006 | Mike Konrad
Flashback time� Vapor degreasers, although still used in limited applications, no longer represent the conventional wisdom (due to multiple environmental issues). Aqueous-based technologies are the most common method of defluxing. Unlike most va
.gif)
