Electronics Forum | Thu Jul 15 22:03:07 EDT 2004 | KEN
In no particular order: Will the failed joints wet when touched with an iron + flux? Is there flux surrounding the joint (post reflow). If no, you may be baking it out premateurely. Is this assembly wave soldered? Where is defect discovered in yo
Electronics Forum | Mon Jul 19 09:05:56 EDT 2004 | Stockley
Chris, it was cunning of you to think of this sequencing solution, but speaking from my lofty position of King of the Workaround, I can only suggest this - forget it. Sorry to be blunt about it but you've said that your operators aren't motivated, al
Electronics Forum | Fri Jul 23 05:03:31 EDT 2004 | loz
I'd be interested to hear what the PWB vendors have to say about your comments. This is something I have questioned before, but I fail to see how this problem can be proved. Because of all the technicalites of the wave soldering process, it is someti
Electronics Forum | Thu Jul 22 12:02:52 EDT 2004 | lloyd
I'm currently having issues with a 28 terminal MLP package. I have only recently started in a new company and it seems as though the manufacturers guide lines as to pad geometry do not work (at least for us). So I now have a situation where I have 4
Electronics Forum | Sat Jul 24 09:06:40 EDT 2004 | davef
We believe that many manufacturers' recommended pads should be close to the last resort. Recommendations are: * Standardize with the IPC guidelines or those by Jim Blankenhorn [ smtplus.com ]. Anyone that wants to change from that standard needs to
Electronics Forum | Thu Jul 22 20:41:11 EDT 2004 | C.W
hi All, i have recently running a Ceramic board with silver/palladium surface finish, using Alpha Metal 63/37 WS solder paste, soldering meet IPC standard after reflow, however, the solder joint look grainy, not sure if there could be too much interm
Electronics Forum | Fri Jul 30 16:41:14 EDT 2004 | Dave
Consider a 6 layer board. The Through via gets drilled from top layer to bottom layer. All 6 layers has the hole drilled in it. A blind via is a via that does not got through the entire 6 layers. It would go from layer 1 to layer 2. or layer 6 to lay
Electronics Forum | Tue Aug 03 09:47:39 EDT 2004 | AJ
Hi All, I have a question for everyone regarding SSD - Solid Solder Deposit. I have read many good articles on this "new" process and was wondering why it has not caught on. It is better known in the US as SIPAD or Precision Pad Technology. Here is
Electronics Forum | Thu Aug 05 19:10:53 EDT 2004 | celldude
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Sat Aug 07 17:27:00 EDT 2004 | celldude
We use ssd on all components, from 0201 to very large fine pitch and bga's. With some very small micro bga's , if there is a problem with bridging, we will tape off the stencil during the ssd process and just use bare pads...along with the solder fr
