Electronics Forum | Wed Sep 03 12:44:34 EDT 2008 | Bob Douglas
When considering MSD issues two factors really need to be focused on; first, environmental control of the individual subject component/s during storage and second, monitoring of the packages out of the controlled environment. It's important that eac
Electronics Forum | Wed Aug 27 08:46:14 EDT 2008 | vladig
Hi Sean, It's an old problem with no definitive cure for now. However, there are a couple of things to look for. First of all the location(s) of HoP. If it was due to the componetn warpage, then it would be most probably in the middle and it should
Electronics Forum | Wed Sep 10 12:44:55 EDT 2008 | vladig
Well, it wasn't as easy to figure out the root cause. The last image is below. It shows how the board finish looks like (the trace was under solder mask). AS you can see, the layer of E-Ni is spliting (the board shop admitted the problem afterwards).
Electronics Forum | Tue Aug 26 03:14:27 EDT 2008 | zpivy
Outlook for a software? PCB Gerber File Auto Checking System(http://www.pcbpartner.com) It can translate Gerber files into standard Specifications fleetly and automatically so as to help users improve the checking efficiency and reduce the cost gr
Electronics Forum | Wed Aug 27 14:58:21 EDT 2008 | omid_juve
we have problem in setting the density of a no clean flux for using before wave soldering . first we dilute the flux but we have many short circuit problem between the pads of edge connector,then we densify the flux all the short circuit is removed b
Electronics Forum | Thu Aug 28 11:07:34 EDT 2008 | saaitk
Can anyone please help me out. I am having solderability issues on a 208 pin QFP. I believe that it may be due to the age of the component. The date code states week 50 of 2003 which is not all that far off 5 years. The component was vacuum sealed at
Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson
First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y
Electronics Forum | Wed Sep 03 19:54:23 EDT 2008 | vladig
Well, I'm not a sale person whatsoever. I'm a purely technical guy (even PhD :-)) who has been with the industry for quite a few years and I know very well what intermetallics means and how thck it should be for different board finishes and solders
Electronics Forum | Fri Sep 05 12:15:34 EDT 2008 | evtimov
All, Does anyone have experience with underfill > 300balls BGA connector? We have a component with > 300balls BGA connector that connectorize with > Flex. Customer wants to have an > underfill > > Questions - Possibility for > underfill 300ba
Electronics Forum | Fri Sep 05 13:21:26 EDT 2008 | gregoryyork
We manufacture a low cost machine completely Air driven for Misprints only but dont have an agent in the USA unfortunately or could have demo'd it for you They do work very well with IPA derivative cleaners but IPA on its own is very poor. Best metho
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