Electronics Forum | Mon May 24 17:32:18 EDT 2004 | pjc
Look to the no-Pb solderpaste mfr. specs for on-board temps. For example, Indium Corp. has a product that performs at on-board temps of 229C. Now, your BTU oven will handle this no problem, as will most modern ovens. Its all about thermal mass. Look
Electronics Forum | Thu Sep 02 15:45:35 EDT 2004 | russ
We don't do any wave, SMT only. We did not have to change apertures for lead free, we use the same stencil that we did when we ran water soluble with pb. This I think might be dependant upon your current design of both pad and apertures however.
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
Electronics Forum | Fri Jul 08 09:57:31 EDT 2005 | fctassembly
Proy, Another issue is what exact formulation of SAC is used. Much of the SAC305 being used in Asia contains phosphorus, which is added in an attempt to reduce the heavy drossing that SAC305 produces. Phosphorus acts as a flux on steel so will increa
Electronics Forum | Tue Jul 05 11:00:37 EDT 2005 | patrickbruneel
Inds, This will happen with all lead-free alloys having a tin content above 70%. It takes about 30 sec. for a molten lead-free alloy to totally dissolve a copper pad. The higher the temperature the shorter the time and visa versa. The scary part of
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
Electronics Forum | Tue Dec 13 14:55:12 EST 2005 | muse95
Your response is from the point of view of using a Bismuth solder with Pb plated leads. Samir's point of view is from Bismuth in the plating on the leads being used with a Pb solder. There is a very large difference in the amount of Bi that will en
Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york
Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili
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