Electronics Forum: alsos (Page 406 of 1042)

Re: Solder Skips

Electronics Forum | Wed Mar 22 10:29:15 EST 2000 | C.K.

Larry: I've got extensive experience with solder skips on both 0603 and SOT23 devices. We also installed an "Omega" vibrating wave on our machine, but it didn't really have an impact on solder skips. The major difference that the omega makes is in

Insert Molded Terminal Selective Soldering

Electronics Forum | Mon Feb 26 19:56:24 EST 2001 | davef

SMTnet Archives used to have copious amounts of information on a pin-in-hole [e.g., pin-in-paste, paste-in-hole, etc] reflow process, but much of that appears lost with the conversion to the new and improved site format. In getting started, check:

Wet behind the ears

Electronics Forum | Mon Apr 30 10:06:13 EDT 2001 | CAL

John- Just few ideas at random (brainstorming) - While times are slow invest in training of your current staff. There are some great training facilities out there offering valuable knowledge. Knowledge is a valuable thing to have and will prove to be

Re: post-training evaluation

Electronics Forum | Mon Nov 27 12:38:10 EST 2000 | rabell

There are a number of issues here. One is having good benchmarks prior to training. Most companies monitor production issues like inventory, scrap, rework, etc. A good ESD program would be performing frequent audits and recording deviations. Hard

Mydata Pick and place

Electronics Forum | Thu May 10 02:57:03 EDT 2001 | kjellman

Hi, Why not have a look at Philips/Assembl�on, their ACM machine is quite nice. It may also bring you down to Flip Chip, 0201 some through hole and odd form placement. Nice options like bulk feeding, coplanarity tests, fluxing for FC, prom feeders (

Re: Siemens

Electronics Forum | Fri Nov 05 17:17:32 EST 1999 | NickMata

Fred, The system will base itself on the information within the GF file. In the GF file you provide the description as to the physical dimensions, features, tolerances and handling for the part. Once the component has picked up the image, it is "see

Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William

All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join

Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple

I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F

| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at

Re: Classification of moisture sensitive devices

Electronics Forum | Sat Aug 28 08:41:12 EDT 1999 | Tom Tellinghuisen

Wolfgang, We also tried to find generic 'guidelines' for Moisture Sensitivity levels. It would be a perfect world, if you could say that all PLCC84's were level 4 devices. Unfortunately it is not that easy. Moisture sensitivity levels are


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