Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Thu Apr 24 13:35:51 EDT 2003 | fmonette
Hi Jason, Welcome back to SMTnet. I just wanted to clarify one important detail relative to dry packing Moisture Sensitive Devices. Contrary to popular belief, it not necessary to use vacuum when sealing Moisure Barrier Bags. A simple heat seal w
Electronics Forum | Mon Apr 28 11:52:28 EDT 2003 | hruiz
Thanks for your responses, as gregp says, one hour in changeover is not good when you run only 10 panels, we alredy do from 10 panels to 2500 boards per run, depends on the product, we already have a pre-kitted area mounted in their respective feeder
Electronics Forum | Thu May 08 09:00:03 EDT 2003 | stefwitt
I like to find out more about your feeder manufacturer. Known problems: If the cover tape peel back is located in the pick up window, the tape may lift the component out of the pocket and when the component falls back it could be inverted. The co
Electronics Forum | Fri May 30 18:57:44 EDT 2003 | russ
We place a large amount of .4mm (what is that in microns?)QFPs every day. I would much prefer a BGA package. Reasons are 1. Pitch is greater which provides a larger process window 2. Alignment is easier because you don't need vision for BGA if you
Electronics Forum | Thu Jun 19 10:36:54 EDT 2003 | Jacob
Hi all I am having a reflow problem. Recently we started using a through hole connector with solder flux bearing technology on a densly populated board. The connector reflows at the same time as the smt components through reflow. The problem I am ha
Electronics Forum | Wed Jul 02 12:42:58 EDT 2003 | slthomas
Not sure how else to describe this. We've received some boards (1/2" x 3.5" x .0325" board built on panels of 24) with numerous resistors showing separation of the solder from the metallization at the top of the joint. There are 26 0805's on the bo
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Wed Jul 09 16:01:10 EDT 2003 | russ
Mike, the one pad that is "small" definitely appears to be over etching (It looks like it was supposed to be much larger). What is the dims of this little bugger as compared to the Gerber? i would also tend to believe that there probably is some mask
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