Electronics Forum | Thu Jun 05 17:30:10 EDT 2003 | abarbe
Hi, Take a look a this site.Lot of information. http://www.pcbstandards.com/SiteIndex2.php
Electronics Forum | Mon Jun 02 13:33:48 EDT 2003 | gregcr
Hi all I have a CS-300E component locator machine. I am looking for the password to get into the "CONFIG SYSTEM" area. I'm not sure if it is the same on all the machines, but I figure someone on here may know. thanks greg
Electronics Forum | Tue Jun 03 12:10:42 EDT 2003 | Paul Stolar
I am having a problem remembering what temp to pretin components at. This is for SN63. I thought I used 450F, but this company says 500.
Electronics Forum | Tue Jun 03 16:45:30 EDT 2003 | swagner
I agree with the other posting about V-score but don't forget about a Wand punch if the application is high volume, also IPTE manufactures a cutting system that doesn't require any V-score, it just cuts the boards apart with a diamond wheel.
Electronics Forum | Tue Jun 03 16:42:33 EDT 2003 | RF Lurker
Does anyone have a method to calculate the thermal resistance of a given copper area?
Electronics Forum | Thu Jun 05 00:00:09 EDT 2003 | Jacky
Hi, Can anyone tell me where I can get heatsinks for DPAK devices? It will be used for cooling IGBTs. Preferably, the heatsink device should be soldered for easy production. Thanks alot.
Electronics Forum | Thu Jun 05 15:34:16 EDT 2003 | davef
Heatsink DPAK SMT Tin Plated: Wakefield Part Number: 21736CT We have no relationship nor receive benefit from the company referenced above. Look here: http://www.heatsink-guide.com/links.htm
Electronics Forum | Thu Jun 05 14:00:12 EDT 2003 | samaniegocesar
Thank you guys, if you have in stock, used or new, can you send me the price to the next email address please: samaniegocesar@hotmail.com cesar_samaniego@condordc.com Best Regards
Electronics Forum | Fri Jun 06 07:15:28 EDT 2003 | davef
Which specific JEDEC standard are you talking about? It's very peculiar that JEDEC would publish such a standard.
Electronics Forum | Fri Jun 06 10:47:27 EDT 2003 | Marc Peo
Kevin, Agree with John's thoughts on profiling and the max temp of 240 degrees in particular. To add to it a bit we have seen the following parameters put in place at many assembly houses to protect against overcooking the components: --Time above
