Electronics Forum | Mon May 21 03:20:16 EDT 2001 | Abbas Izad
you can use IPC and Compact PCI standards for guideline then it depends on what kind of connector you want to pressfit. each supplier has its own design on pressfit pins like "needle eye", "baby H" etc... It is also importand to use proper equipement
Electronics Forum | Fri May 25 15:57:15 EDT 2001 | robert
you should be able to get the force requirements from the connector manufacturer. Both the minimum and maximum forces used in the pressing cycle should be recorded to know the connector is properly seated without excessive force that can damage the
Electronics Forum | Thu May 17 12:59:09 EDT 2001 | rwilliams
I would like to know peoples' thoughts on measuring solder paste height. I am having difficulty fully understanding its value. Is it better suited to a production environment, or more of a lab environment? Our screen printers are not fitted with on-
Electronics Forum | Fri May 18 12:21:28 EDT 2001 | camohn
When it comes to how much epoxy [aka. "glue"] to dispense to hold a IC or any part with significant mass, on the bottom of a board for wave soldering, is more better? The way I see it, one good dot should be holding such a part on the PCB. If not, th
Electronics Forum | Fri May 18 13:41:34 EDT 2001 | mparker
Good ol' Yankee engineering always says "More is better" You have got to be careful that with more epoxy volume you run the risk of the epoxy merging with solder paste if you are using a glue and paste process. In addition, if the epoxy can spread o
Electronics Forum | Wed May 30 17:59:16 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Wed May 30 17:59:24 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Wed May 30 18:35:04 EDT 2001 | Robert.Culpepper@Transcore.com
Were not placing 0402s nor do we have a Sapphire. We are placing 0603's with both the Topaz and Emerald though without any problems. I would like to ask you if you are using any programming software for CAD conversions such as PPS or Unicam and your
Electronics Forum | Tue May 22 00:01:43 EDT 2001 | philipreyes
Hi to all!! For those who have current process of Placing BGA package (SMT using BGA package), do you have any idea what is the acceptable misalignment of the balls on the pads of PCB? I have here with me the IPC 7095 BGA Assembly and Design but
Electronics Forum | Thu May 31 15:04:49 EDT 2001 | flipchip
Check out APE's web site. http://www.apecorp.com There is also a repair video at http://members.nbci.com/smtrework/chipmaster.ram showing cans being removed. If you have any questions or want to see a demo in house, give us a call. 305-451-4722
