Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
Electronics Forum | Thu May 06 10:52:08 EDT 2004 | John S
Many component manufacturers are moving to Pb free terminations. I've been doing a literature study of Pb free processing and have found several articles that indicate Pb-free paste with Sn/Pb terminations leads to early fatigue failures. Does anyo
Electronics Forum | Thu May 06 15:46:08 EDT 2004 | Automation Engineer
I am looking at putting in a 100,000+ cph assembly line capable of processing 8" X 8" boards. Mix is passsives down to 0402, 15 mil pitch flip chips. I would like to hear what comments you have on the new Assebleon AX, Fuji NXT, Siemens HS-60, Univ
Electronics Forum | Thu May 06 21:21:34 EDT 2004 | samaniegocesar
I'm looking support in California or other state in the border near Mexicali City that can give us training to operate and programing the SMT chipshooter Universal 4790. If exist some person available let me know the cost of trainig during 5 days..
Electronics Forum | Fri May 07 11:30:48 EDT 2004 | Mike Cyr
Hi Cesar, If you will contact me directly, I can help to arrange 4790 operations and programming training for you. Please call me directly at Universal Instruments so that I can understand your situation and provide the best possible response. Or E-
Electronics Forum | Fri May 07 12:02:28 EDT 2004 | Dreamsniper
From my understanding paste on BGA pads are applied only to help in holding the component as the PCB is conveyed during the manufacturing process then soldered. But during rework on BGA's do I have to apply Solder Paste or just Flux? What's the diffe
Electronics Forum | Fri May 07 20:08:39 EDT 2004 | Ken
...um also, don't forget that ther are planarity issues associated with BGA devices AND bow-and-twist issues with PCB materials. An example I have one BGA device that has a ball planarity of 7 mils!!! Ant that's the OEM specification! THis will re
Electronics Forum | Wed May 12 07:34:42 EDT 2004 | RLeonard
The standard machine is set from the factory at 7-9 degrees, 7 is the most standard, why are you considering the change? before doing any thing to the machine, first identify why? what type of defects are you seeing? I have found, depending on the t
Electronics Forum | Mon May 10 11:24:33 EDT 2004 | Charly
Encounter solder ball crack after reflow, found the solder ball is out of shape after reflow, cross section view found that the solder mask opening is not good ( when we do comparason with diff. supplier substrate.) Does the solder mask shape will af
Electronics Forum | Mon May 10 18:05:31 EDT 2004 | daman
We are trying to solder a Surface mount relay having lead free finish on the leads. The leads are not getting soldered down during the reflow. The leads also look oxidized (failed our solderability test) but we don't have an option but to use these r
