Electronics Forum | Mon Dec 18 17:05:07 EST 2006 | darby
Now, now, Bag the guys in the Technical Centre all you want, but don't be too hard on the Seattle Robot Guys. They're just trying to find a way to make something. Sort of like building a PC with a paddle-pop stick and a bit of fencing wire. By the wa
Electronics Forum | Tue Dec 19 01:57:52 EST 2006 | hemu_me
we have fuji's cp-iv-3 machine made in 1993.we are facing problem everytime when we change the jobs(for example we change from pcbA to pcbB to pcbA)even though program is same. There are some mechanical adjustments like conveyor adjusted according to
Electronics Forum | Tue Dec 19 03:46:24 EST 2006 | en
I facing problem when running glue process. the glue size cannot maintain with the same size when the glue in syrince reduce. it become smaller, smaller and smaller compare to the time. Beside, when there have any changing model, the machine stop for
Electronics Forum | Tue Dec 19 07:58:29 EST 2006 | ccgooi
Our company is assembly flip chip on flex, we have new design of flip chip which die temperature will increase until 145 degree C after test run the end product, however the Tg,glass transition temperature is 148. Will this case causing any reliabil
Electronics Forum | Tue Dec 19 08:32:44 EST 2006 | davef
Take your choice: * Can't image this is a good thing. The board under the die will 'dry-out' and turn brittle over-time. It's possible the way attachment glue bonds to the board will change as the board dries-out. * Epoxy suppliers pad their number
Electronics Forum | Tue Dec 19 21:23:39 EST 2006 | davef
We'd suggest using your connector supplier recommendations. Some use: * Pad Plating: 20-30 uin Au over 50 uin Ni (You might get away with less gold) * In-Pad Vias: less than half the diameter of the button (for contact-only configurations) * PCB/C
Electronics Forum | Wed Dec 20 16:30:40 EST 2006 | CK the Flip
I've seen smaller components have a "charred" appearance and a lack of wetting up the component termination. Also, extended heat exposure may introduce excessive IMC (intermetallic) formation - the bad kind, that is. That's where your IMC layer wil
Electronics Forum | Tue Jan 09 10:13:40 EST 2007 | slthomas
You could probably make do with two as long as you attach to the smallest part in a sparsely populated area and a large heavy part in a densely populated area to cover both ends of the spectrum. When I had a MOLE I used all 6. Now I use the 3 the ove
Electronics Forum | Wed Jan 10 17:11:53 EST 2007 | mscalzo3
I always try to profile using a fully populated board and soldering the thermocouples. This is the only true way of getting an actual temperature of the joints. But, with that being said, its not always feasible to use this. There have been a coup
Electronics Forum | Thu Dec 21 08:31:32 EST 2006 | Karkanov
Hi, Do you have any idea if there is some tool to inspecet if we have the right component on the board ? like a smart tweezer. Also I'm looking to find a tool to spice smt reel. I need that because our buyer told us they will only buy cut tape.
