Electronics Forum | Thu Sep 29 03:40:43 EDT 2005 | aj
I have over 6 years experience working on Dek Printers, and I would highly recommend them to anyone BUT I have never seen the 2D Inspection last any longer than a couple of weeks running on the machine. This is the one side of things that they FAIL.
Electronics Forum | Fri Sep 30 04:35:34 EDT 2005 | Rob
Expect to get a LOT of feeders & toy's for $40-50K as I've seen good GSM1's go for a lot less. In the US SMT Sales are a good source of used GSM's - http://www.smtsale.net We are in no way linked to this company, nor benefit from them, however we wi
Electronics Forum | Fri Sep 30 09:03:55 EDT 2005 | davef
Pick and place: * Fuji: The largest pcb size is 20" by 18" for pick and place; 18"x14" for chip shooters. * MYDATA has machines that can be configured to 34" X 44" X 0.500" * Fuji has the NP XL series that will allow 27 by 23 inch boards using a con
Electronics Forum | Thu Sep 29 19:18:24 EDT 2005 | HLy
Hi, I noticed that the solder joints on my BGAs end up with a lot of wrinkles after reflow. See picture at: http://pstr-r02.ygpweb.aol.com/data/pictures/02/01A/17/DD/E3/9E/n8BhepQLFDs6GMSwaRNxPCTWR5NdpUJZ0300.jpg Does anybody have any ideas what cau
Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC
The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th
Electronics Forum | Mon Oct 03 21:15:16 EDT 2005 | adlsmt
Its a single board, one up. 4 layer, pretty simple, no large copper pours. We get these consigned from our customer so I cant work that end of it but wanted to make sure to cover everything I can. The oven it runs in was just checked out by the facto
Electronics Forum | Mon Oct 03 22:12:53 EDT 2005 | davef
When we see warp and twist, we usually jump the fabricator for: * MLB construction (not homogeneous or unbalanced - too resin rich or poor) * Supplier process capabilities (lamination cycles) * Material selection (usually cheap and dirty), etc. War
Electronics Forum | Sat Oct 01 01:04:47 EDT 2005 | ck
I face a problem where the components termination is non lead free but solder alloy is lead free. Thus i am using hybrid reflow profile. The specs for the reflow profile i am using: reflow temp. 120 to 160 deg C; time 90 to 120 sec. As for the pak te
Electronics Forum | Sat Oct 01 11:48:45 EDT 2005 | Hiram
Hello everybody, We are in the process of implementing NC process on the wave solder. We have a Sonotek XL fluxing system. Any ideas out there? Solder used: SN100C Flux options so far: 264-5 flux, 270WR VOC-free 9both from AIM solder) The flux ch
Electronics Forum | Mon Oct 03 09:24:38 EDT 2005 | John S.
We are implementing a high volume dedicated product line that will be doing lead free selective soldering. There seems to be 3 basic technologies. Wire fed (Panasonic Softbeam or Laser), solder pumps and chimneys (Pillarhouse, SEHO, ERSA, etc) and
