Electronics Forum | Wed Feb 10 02:10:39 EST 1999 | zeek
| Any thoughts from FUJI users on the likes and dislikes (pros and cons) of MCS vs. F4G , and vice versa? | | Likewise, are there any "FujiCAM" users out there who would like to comment as well? | | Thanks. | We have had some experience with both
Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty
| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what
Electronics Forum | Thu Feb 04 16:08:05 EST 1999 | Ryan Jennens
| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. | | Thanks much, | | Earl Moon |
Electronics Forum | Thu Feb 04 09:22:56 EST 1999 | Terry Burnette
| Hello all, | | Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? | | We've checked our solder paste amount, and we've rechecked our reflow profiles and nothin
Electronics Forum | Wed Feb 03 16:45:20 EST 1999 | Mark Henebry
Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connector
Electronics Forum | Tue Feb 02 14:53:56 EST 1999 | Tony
| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | | | Al, I have been using the same process as Justin recomendations. I have been verry su
Electronics Forum | Tue Feb 02 09:51:38 EST 1999 | Justin Medernach
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Tue Feb 02 21:55:20 EST 1999 | Jon Medernach
Chris is correct. You will have a problem if you do not have the right metalization under your bump. The BM is critical, it is defined by the passivization layer on top of your die much like a solder mask defined interface on FR4. You will find mos
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
Electronics Forum | Tue Feb 02 10:12:50 EST 1999 | Justin Medernach
| Does anyone have any reliability data /concern on pressfit rework/repair - is there any qualified /characterized equipment /tools present in the industry? | What kind of effect does it have on barrel plating quality (1.5mil avg.) after 1 time rewor
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