Electronics Forum: ams (Page 606 of 856)

Accuracy Requirements for New Technology

Electronics Forum | Fri Apr 08 09:32:09 EDT 2005 | bystrom123

We are using a low end Air vac system to place the BGA's. We have X ray we can use. Our CGA's as well use this system. They are one off parts that are above the 20K a piece range. So I have been tasked with making sure all of these procedures are the

Reflow Oven Selection

Electronics Forum | Sat Aug 27 12:45:44 EDT 2005 | Mark

Thanks for the replies. Interesting white paper. Didn't quite answer my concerns but still a good read. I was actually surprised that to test temperature uniformity across the zone, they attached T/C's to the substrate rather than measure the ai

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 11:28:11 EDT 2005 | LeeHoMa

hi Steve/Pete, Thank for your email to affirming our current mounting and soldering flow! In fact, I also don't see any problem for the pilot run(though in small volume - 500pcs). However, the problem is - I am challenged by my customer that the AI

ABW Systems TSC1008

Electronics Forum | Sun Nov 27 11:32:30 EST 2005 | cyber_wolf

They may tell you it will solder lead free,(and it may) but trust me...you are going to have nothing but headaches. If you start flooring the heaters you are going to put it into a "melt down" after a while. I know you don't want to hear it, but tak

Thru_hole component placement

Electronics Forum | Fri Jan 27 16:58:24 EST 2006 | solderman

Hi Ams, I often cringe when I read replys like the ones you got. I will give 'chris' the benefit of the doubt in that he is sincere in his response. However, there are people posting here with agendas to sell specific equipment. Without knowing

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane

I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of

Fighting solder beads

Electronics Forum | Tue Mar 21 02:15:26 EST 2006 | pavel_murtishev

Good morning Dave, Here are some of my assumptions. Please correct me if I am wrong. 1. Mask opening. Due to mask to PCB misregistration mask is not always centered relative to pad center how is should be. Sometimes edge of the mask matches with ed

Running with sn100c in my solder pot!

Electronics Forum | Fri Jun 09 11:55:34 EDT 2006 | jbrower

Howdy Amol, As far as I can see, there aren't too many pitfalls with SN100C. Just make sure to keep all of your alloys seperated. The issues that I am working out right now is the profiles with our wave pallets and some of our larger components. We

smt rework

Electronics Forum | Sun Nov 19 16:37:06 EST 2006 | finepitch

Hi RJK, 2.5 years ago, I pointed out the exact same thing you did now. (please see the below link) http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=7076&#Message28261 I am a competing brand's rep for 3 years, but p

i-PULSE placement systems

Electronics Forum | Thu Sep 21 20:37:21 EDT 2006 | basem

Does anyone on this forum has experience with any of i-PULSE SMD placement systems? I am looking at the M4e. Also, can someone advise me on what to choose if the desired final circuit is of very high density and small pitch (0.5mm)? I am considerin


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