Electronics Forum | Thu Dec 01 21:30:31 EST 2005 | davef
Primary methods used to test assembled circuit boards are: * Automated test equipment [ATE] * Manual bench-top functional test equipment Assembled printed circuit board ATE market segments are: * In-circuit ATE * Functional ATE * Boundary Scan AT
Electronics Forum | Sat Dec 03 03:56:47 EST 2005 | hamidrezamaddah
Primary methods used to test circuit boards > are: * Automated test equipment [ATE] * Manual > bench-top functional test equipment > > Printed > circuit board ATE market segments are: * > In-circuit ATE * Functional ATE * Boundary > Scan ATE
Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef
MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett
Electronics Forum | Tue Mar 07 14:18:32 EST 2006 | James
Billy, I have to disagree with you. We inadvertently soldered a Pb BGA with SAC305 paste and then had it micro sectioned and spectrum analyzed. Imagine our surprise when we saw the spectrum analysis showed Pb. The micro sections showed none to ac
Electronics Forum | Sat Jul 29 09:29:16 EDT 2006 | davef
A flying probe tester is a mid-speed placement machine with no feeders and the placement heads replaced with manufacturing defects analyzer test probe activator head. It is useful for testing bare boards, first piece inspections, and low volume prod
Electronics Forum | Fri Aug 11 16:19:39 EDT 2006 | T. Oaks
Hi, We have a issue with current leakage between pins on an SSOP 28 in a low frequency RF application and there is a suspicion that it is being caused by something in the flux residue. We have had the bad boards analyzed and a 'high' Chloride level w
Electronics Forum | Wed Jan 03 09:59:52 EST 2007 | Jim
Hi, I was looking for information on failure rates for BGA components. I am analyzing our BGA rework rates and find it difficult to define a root cause when a remove and replace of the BGA component corrects the test errors. Inspection prior to re
Electronics Forum | Wed Jul 09 08:32:11 EDT 2008 | davef
In our shop, a very large portion of the mistakes in the shop have their genesis with someone one other than the person making the mistake. Often, it is a chain of events that lead to the mistake. How do your picture posting systems drill down to de
Electronics Forum | Wed Sep 10 10:49:23 EDT 2008 | slthomas
You missed my point. People often don't find the need to post their problems here to begin with because "knob turning" solved them *before* they needed to lean on the collective experience of SMTnet, Technet, or what-have-you. Your posts seem to b
Electronics Forum | Mon Oct 20 17:03:05 EDT 2008 | davef
Josh From looking at your pix, we don't have a clue. [And we're going down to the nurse's station to get our eye checked because we don't black bubkus.] More than anything else the: * White on the pads could be solder * Copper-penny brown on the pad
