Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
Electronics Forum | Thu Oct 05 11:40:49 EDT 2006 | Mario Scalzo, SMT CPE
David, We have seeing this more and more in the recent weeks. In a nut shell, yes; we believe that the voids that you are seeing are from the trapped air in the via from printing over it. If you could remove the Kapton tape, this might help. Also
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
Electronics Forum | Fri Oct 20 11:23:33 EDT 2006 | mmjm_1099
Good morning/afternoon/evening everyone! I am seeking the assistance/guidance of anyone who has had practical experience with placing, soldering, and rework of this particular component. One of our customers is looking to use this component on quit
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Electronics Forum | Tue Oct 24 10:03:24 EDT 2006 | billyd
All - I'm hoping I can get a little feedback here on my package libraries for my Mydata machines. I have four tied to a server right now, and I have several operators that apparently like to make packages, so I have some called 0805-05-A-MY-9-2 and t
Electronics Forum | Tue Oct 24 11:26:03 EDT 2006 | geb
Hi, I've had some trouble with one of my GSM cameras. Its a 1 mil camera (in circular housing). Some components have fallen down the gap between the glass cover and the LED array closest to the rails. One of the resistors (closest to the left) has b
Electronics Forum | Sat Nov 04 07:46:36 EST 2006 | itwasbill
Hi all, What are the pro's and cons of pasting ahead? The definition of pasting ahead for this question is the act of pasting 10 or 15 pc boards and then running then repeat. I do not like this philosophy. I'd prefer to paste, run, reflow then
Electronics Forum | Mon Nov 06 05:50:28 EST 2006 | aj
Bill, I thought I had it bad here!!!! I am sure if you contact your Paste Supplier they will give you all the advise you need. Better still contact a Printer Supplier and tell him to assist you in justifying the purchase of a new printer.(I am sure
Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef
We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"
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