Electronics Forum: any (Page 891 of 1651)

Lead Contamination....Coplanarity???

Electronics Forum | Wed Feb 09 13:07:01 EST 2000 | Jeff Woodruff

I have seen an issue that escapes our ICT and functional testing or operates in an intermitent fashion. The lead is slightly separated from the PCB with a fully formed solder joint behind it at the heel an toe. The joint apears to have started to tra

Criteria for the Omega Mete from Alpha Metals Inc.

Electronics Forum | Mon Jan 08 10:49:35 EST 2001 | Simon

We are using the omega meters to determine the solvent extract conductivity. The book is refering to standard MIL-P-28809 who specifies a 14 ug/sq. in. of Na/Cl limit. The past owner of our machine was setting the pass/fail limit at 3.6 ug / sq. in.

Re: ESD floor paint/coating

Electronics Forum | Fri Jan 12 09:44:17 EST 2001 | blnorman

Having formerly worked for a solid rocket motor manufacturer, we were extremely concerned with ESD. I'm not sure of the specifics, but all our floors were painted (concrete). All employees in these areas wore steel toed, conductive shoes, to dissip

Clean before conformal coating?

Electronics Forum | Thu Jan 04 17:26:17 EST 2001 | Cory

We're going to begin conformal coating a few of our assemblies as required by our customer. We're using Kester No clean paste and will use cotton gloves to keep the boards clean while handling. My question is: Do we need to clean the boards prior to

Re: Component Identity Help!

Electronics Forum | Thu Jan 04 21:27:39 EST 2001 | John L.

Thanks for the reply Stevo...! I am looking at doing just that. I would really like to ID this component and repair this Pico board though... After several searches, I can't find any (3) element resistor or capacitor networks to match it. I'm hop

Double sided assembly

Electronics Forum | Fri Dec 22 12:17:02 EST 2000 | vickij

Hi! Has anyone out there ever tried to use a high-temp and a low-temp solder paste on a double-sided board without using an adhesive? (Populate the bottom side with the high temp paste, reflow, turn it over, then run the top side). I looked in the

Re: Double sided assembly

Electronics Forum | Tue Dec 26 11:09:16 EST 2000 | acahill

High temp paste or not, I feel it's all up to the oven,and/or the stencil design. are there sufficient solder joints, before running the opposite side (are the apertures large enough to achieve a hardy fillet or to small, allowing enough paste to vis

Re: Double sided assembly

Electronics Forum | Tue Dec 26 15:22:43 EST 2000 | Hussman

Vickij, Why not try using regular temp. paste for both sides? Unless you have some real heavy parts on both sides, you can run a double-sided reflow process with most boards. I myself like to place R's and C's first (or bottom side) and then do an

Solder Ball Voltage Capacity

Electronics Forum | Tue Dec 19 20:01:41 EST 2000 | Lisa Murphy

Hi, I have recently been asked if I had any information on the voltage capacity of a solder ball. I asked around and did a web search but came up empty handed. Usually people are concerned with the current carrying capacity of bondwires, flip-chip

Help! Cognex computer on MPM AP24x

Electronics Forum | Wed Dec 13 16:40:40 EST 2000 | Bill Fluegel

I am receiving a "cognex not found" error upon bootup of a MPM AP24-X stencil printer. I have checked everything I can find between the cognex computer and the one in the machine. Has anyone experienced this before? Any ideas would be greatly appr


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