Electronics Forum: applied (Page 86 of 188)

Pin-in-Paste, Intrusive Reflow, Solder Preforms, etc.

Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ

Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in

Inspection and splicing

Electronics Forum | Wed Aug 22 14:25:22 EDT 2007 | russ

Go inform the owner of your company that you are spending hours of labor dealing with these parts instead of spending the extra 4 dollars it takes to buy an entire reel. When we deal with strips we make sure that an extra amount is ordered to apply

Pin In Paste IPC Guidelines

Electronics Forum | Thu Jan 04 02:25:12 EST 2007 | Loco

Sorry Dave? There is a seperate table safely hidden away in the D version, but i dont know if it is something new. chapter 7 THT - 7.5.5 Supported holes - solder has a table specifically for PIP, table 7-7 Plated trough holes with component leads -

Lead free rework of BGA

Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39

When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.

silicone conformal coat and electrical contacts

Electronics Forum | Wed Jan 31 17:01:34 EST 2007 | rw

I'm not that concerned about the solderability of the motor. Our customer is concerned about the outgassing of the conformal coat effecting the motor brushes. Silicone will break down into SiO2 and SiC will result from a spark between the brushes a

Printing off contact

Electronics Forum | Tue Feb 20 08:19:54 EST 2007 | Steve

One question about the build to print statement; is there some note saying that the vias are to be plugged with mask? If so, I'm wondering when the circle of mask was done over the vias. If it was done as a secondary operation after flood coating, t

BGA Tilt

Electronics Forum | Fri Feb 09 16:29:22 EST 2007 | dave

Hi All, Thanks for all the replies. I am placing a 672 Pin BGA. Its the only BGA on the board (Board size 220mmx100mx1.6mm) We build these in batches of 400. So we have built approx 1200 since transition to Leadfree. Latest batch had 7 fails -

CSM84 doorway ?

Electronics Forum | Fri Mar 02 15:09:21 EST 2007 | jmelson

21 hours to go, then I find out whether I own the boat anchor or not! Ahh, going down from 1300 to 960 mm is a great reduction! (Of course, that's a different machine, so it may not apply.) Maybe I'll try to get some more detailed pictures to figu

battery pad

Electronics Forum | Wed Feb 28 14:25:33 EST 2007 | Bill

We have a board that uses a solder pad for one of the contacts of a button battery and had no problems when we were washing the boards. We are now using a no-clean flux and find that on a bunch of boards there is a coating of flux covering the pad s

Baking MSDs in tubes?

Electronics Forum | Mon Mar 05 17:19:38 EST 2007 | bman

I've wondered about the 5% spec myself. Section 4.2 points out that "The oven used for baking shall be vented and capable of maintaining the required temperature at less then 5% RH.", leading me to believe this spec even applies to ovens used to bak


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