Electronics Forum | Thu Oct 22 14:20:57 EDT 1998 | Dave F
| Dear Folks: | | I am currently in the pre-prep stages of a market study that's focusing on different methods of microprocessor cooling and the market potentials of new designs. I wonder if you might be so kind as to point me to good general resou
Electronics Forum | Tue Jul 07 13:05:43 EDT 1998 | Bruce Carnegie
We're running mixed technology boards with moisture sensitive devices on the top side thru our wave machine. Should I be worrying about "popcorning" these devices if they have been sitting out collecting moisture between the application of SM devices
Electronics Forum | Thu Jun 04 15:02:38 EDT 1998 | M. Faisal Pandit
Frank, A couple of suggestions: 1. You may consider investing in a SPC Software package which would allow you to do a detailed analysis of your process. Panasonic's CIM Software Product, PanaPRO, has a well defined SPC application that can be used fo
Electronics Forum | Mon Feb 23 13:21:03 EST 1998 | Gary Simbulan
Gary, Paladium Leads have been a win-lose proposition as far as I can tell. The vendors win because they don't have to deal with lead and get higher yields. The users lose because of extra engineering time involved with incorporating this on their
Electronics Forum | Fri Jul 09 16:50:25 EDT 1999 | Mark
There is a company named BGA Bumps that reconditions BGA IC's. Check out their web page www.bgabumps.com(below). As far as process specs you should look at the July 1999 issue of Circuits Assembly Magazine detailing many complex rework process and co
Electronics Forum | Sun Jan 11 11:59:13 EST 1998 | Bob Willis
VP does work well for BGA Technology but it is not any great improvement on convection reflow. It has been stated in a coulpe of articles that there is no delta T difference with VP from the surface ofthe board and under the BGA. That is not true jus
Electronics Forum | Mon Aug 06 12:30:51 EDT 2001 | Brad R.
I am having some SMT assemblies undergoing thermal shock testing per MIL-STD-883, Method 1011, Test Condition B. I was wondering if anyone has a chart, equation, article, etc. that will give me an idea of the service life of the assembly after it su
Electronics Forum | Mon Aug 13 18:21:54 EDT 2001 | delnosa
Trying to find out if there are any data/articles/references out there that looks at the reliability of using SMC�s over interconnects(connectors). The dilemma is having a daughter card with a board-to-board connector vs. having the components (dis
Electronics Forum | Tue Sep 11 09:13:01 EDT 2001 | davef
Like most things in electronic assembly, this is not astrophysics. People have pasted boards, placed components, turned the board up-side down, run the board through a reflow oven, and generalized about which components: * Fall off the board. * Don
Electronics Forum | Fri Oct 12 14:32:52 EDT 2001 | Mike Konrad
Hi, Maybe Yes� Maybe No� Actually, it most likely is acceptable to clean assembled boards in an ultrasonic cleaning system (40 kHz). There are some concerns in some circles about possible damage to wire bonds in components. There have been publi
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