Electronics Forum | Wed Aug 08 17:26:40 EDT 2007 | htran
Hello All, I have been searching for the board assemblies bake out requirements acceptance criteria but unsuccessful. Does anyone knows if there are general guidelines for the percentage of the moisture absorption in the PWBs and PWAs? Thanks, Tran
Electronics Forum | Thu Aug 16 14:20:20 EDT 2007 | hussman
You may call a few used machine people. They may have them or know of a company that is going under and looking to get rid of them. Also try E-Bay.
Electronics Forum | Thu Aug 16 19:28:23 EDT 2007 | karenp
What do you think is gonna impact or benefit using board without silkscreen on it, talking about quality and manufacturing methods??.. I mean.. it is an opportunity or bad idea.. specs of assemblies refers always to references on board so schematics
Electronics Forum | Mon Aug 27 07:57:38 EDT 2007 | davef
Most suppliers provide guidance on proper assembly technique, like: http://global.kyocera.com/prdct/electro/pdf/add_pdf/111_119_e.pdf We have no relationship, nor receive benefit from the company referenced above.
Electronics Forum | Mon Sep 10 13:46:26 EDT 2007 | mobytahoe
One of our customers bangs the assembly on his table top to see if parts will fall off. Darwin is alive and well in the OEM world...
Electronics Forum | Mon Sep 10 23:13:08 EDT 2007 | weehn
hi, i'm from the semicon (BGA assembly). Could you advice what is the best method / procedure to remove OSP coatings from pads of the BGA substrates. thanks Wee
Electronics Forum | Thu Sep 27 15:26:57 EDT 2007 | ghenning
Can anyone recommend inexpensive testers for custom cable assemblies? I found a few from Adola, YPU, Cirrus, and Banair on Google. Your help is appreciated... George
Electronics Forum | Mon Oct 08 03:53:08 EDT 2007 | d0min0
Hi, we do stepper motor assembly, and "use" both methodes; coil is selective soldered before entering line and then coils & I/O connector are soldered to PCB with robot (in many points also manual soldering) regards Dominik
Electronics Forum | Thu Nov 01 21:05:31 EDT 2007 | davef
no inspection * Failing to meet expectations => inspection In asking if you observed the problem at incoming inspection, we should have asked the question differently. Have you observed the problem in stock items, prior to assembly?
Electronics Forum | Fri Nov 02 10:57:11 EDT 2007 | 85638
7500 mm3 in combination with very small devices like 0402 in the same assembly ?. I am facing profiling problems due to this extreme mix. Thanks in advance for your valuable inputs.
