Electronics Forum | Mon Mar 17 09:53:21 EST 2003 | Rob
I used the MS Outlook exchange sever task list very successfully for a similar situation. Which allows you to set up a shared folder between you and lead assembler. Everyone can electronically view (read only) your production schedule, and email noti
Electronics Forum | Sun Mar 02 21:33:58 EST 2003 | caldon
I like the Idea of supporting the PCB during assembly but do not know if I am sold on TA system of doing such. The TA system does not lend it self well to any Engineering changes. The concept is sound but feel the system from Airline Hydraulics is a
Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Tue Mar 04 07:37:07 EST 2003 | msivigny
Hello Ryan, I'll be completely honest, I haven't seen anything on the radar scope but I haven't been tuned to ESD issues. Everything I've seen in the industry ranges from complete compliance with Class 10,000 clean rooms to questionable use of foot s
Electronics Forum | Wed Mar 05 10:59:04 EST 2003 | jfb2003
Currently, my company's applies a PCB bake (5 hours @ 125C) for all SMT PCB's prior to surface mount assembly. Many of us believe this is a non-value added activity, and have concluded it can be eliminated. With today's PCB process controls coupled
Electronics Forum | Thu Mar 13 15:22:47 EST 2003 | ruggi
Ditto on the profile/reflow oven...a couple years ago, we had a huge increase in the number of tombstones found post-reflow. Profiling the oven showed a decent curve with some innocuous minor deviations, and further investigation of the oven found 2
Electronics Forum | Sun Mar 23 00:09:02 EST 2003 | MA/NY DDave
Know the specs your assembly is supposed to meet 2>Runs some lot soldering samples to minimize cost if you do decide to scrap or bake or ?? 3>Do at least a little post soldering analysis to assure yourself that the results are similar to experien
Electronics Forum | Mon Apr 14 12:40:28 EDT 2003 | jimcorr
They are letting you go on holiday with these problems outstanding??!! But seriously after reading about your problems I think that any further work is basically throwing good ��$$ after bad and reworking BGA almost always ensure that they will fail
Electronics Forum | Thu Apr 10 17:44:22 EDT 2003 | davef
Q1: Can they be masked so parylene doesn't get underneath? A1: Your parylene applyer may be able to mask area, but in general no. This stuff is cured in a vacuum chamber to make sure that it gets into every past corner. Q2: How do you remove and re
Electronics Forum | Thu Apr 24 09:34:37 EDT 2003 | caldon
We autoclave our medical PC boards (Sorry Bad Joke). With the Steam process I am concerned that the water (Solution) is not Clean. So I am curious to the process of steam cleaning: Is It Presure Steam? is the Water DI, ION free, street water...? you
