Electronics Forum | Mon Jun 14 23:12:32 EDT 2004 | Rodion Pronin
Hello Ricardof I believe speaking of your example, huge boards with many components on them, a very important aspect would be the sequence in which you place your components on the board... It happends that I have a software that optimizes assembly
Electronics Forum | Thu Jun 17 07:04:03 EDT 2004 | davef
It sounds like the parts are not soldering properly [have poor solderability]. This probably due to corroded nickel underplate caused by: * Nickel that oxidized, while awaiting overplating * Poor quality tin overplate, allowing nickel to oxidize aft
Electronics Forum | Wed Jun 16 21:56:04 EDT 2004 | rodionp
For those who are not sure as to what exactly we do, please get familiar with the article: http://www.reed-electronics.com/semiconductor/index.asp?layout=article&articleid=CA71291&industryid=3026 Which is PCB Assembly Optimization, what we do is we
Electronics Forum | Tue Jun 22 11:14:03 EDT 2004 | Steve Thomas
A very quick survey regarding PCB finishes for a lead-free process. What is the most popular PCB finish for lead-free soldering ? Who drives the selection of the finish, assembler or designer ? Are tin whiskers an issue for anyone ? I'm coming at th
Electronics Forum | Thu Jun 24 12:30:06 EDT 2004 | deonn
Thank you for your input Russ. I do understand the technical challenges that 0402-0201 present. As a matter of fact, I personally think it is a bad idea for these devices to even be processed using conventional assembly methods when the alternative
Electronics Forum | Sat Jul 03 11:20:08 EDT 2004 | KEN
....not unique. But tough as hell! I build flex assemblies for a major P&P equipment manufacturer. Some are pure flex, most are ridgid flex. And of course, why put fiducials on the boards to help the process (why God, why me?) We use pallets and
Electronics Forum | Tue Sep 14 04:28:36 EDT 2004 | Rob
Hi Dave, 3M� Spray 75 Repositionable 500 ml was the last we used due to a bright spark in purchasing, but production didn't get on with it too well. The only one that really gives us good consistant performance was the original 400ml Spraymount a
Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette
The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy
Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t
