Electronics Forum: assemble (Page 351 of 600)

ICT bare board

Electronics Forum | Mon Mar 12 03:41:25 EDT 2007 | tanemmirt

i designed a new product; i want to produce it in china, so they requested the ICT to be done; i have 03 questions if some one can help me on: 1� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? 2� testing

radial/thru_hole insertion

Electronics Forum | Fri Mar 16 08:42:25 EDT 2007 | AR

Of course, if the number of required component codes ( = feeders) is not very great, you might want to look into odd-form assembly machines. With them you can insert a much greater range of components than just simple radial components and you can ge

Overall Equipment Effectivness

Electronics Forum | Tue Mar 13 09:09:23 EDT 2007 | cyber_wolf

We have been asked to provide the OEE on our SMT lines. Any examples of OEE reports that I have looked seem to be from OEM or high volume production lines. Our SMT area is high mix - high changeover. We also run prototypes and start-ups through the

SMT INSPECTION SYSTEM

Electronics Forum | Wed Mar 14 01:51:55 EDT 2007 | CHITRA K

We would like to buy a good microscope for visual inspection of SMT PCBs especialy for highly populated PCBs assembled with fine pitch components including BGAs . Please advise a suitable type of equipment visula inspection for volume production. A

BGA rework

Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL

Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein

HOW TO REDUCE MACHINE COMPONENT ATTRITION?

Electronics Forum | Tue Mar 20 21:49:38 EDT 2007 | davef

Mark there is no need to YELL here. Turn it down, please. While you're waiting for other to reply, search the fine SMTnet Archives to find threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=34512 You'll find that the followi

top side remelt?

Electronics Forum | Tue Mar 27 07:34:57 EDT 2007 | ck_the_flip

Amy, One way you can drastically lower the peak temperature of your QFP and prevent it from re-melting is to lower the solder pot temperature. If you're running 63/37 in your pot, the typical range for these is 460�F to around 500�F. You will need

Defect Per Unit (DPU) versus DPMO

Electronics Forum | Fri Mar 30 06:58:24 EDT 2007 | ck_the_flip

Alot of QM's and QE's are typically failed Engineers who lack common sense. They don't understand that measuring in DPMO's (versus DPU's) "normalizes" your data for Printed Circuit Board Assemblies (PCBA's) so that if you have 10 defects on a PCBA t

Rigid Flex Wave Soldering

Electronics Forum | Thu Apr 05 08:59:43 EDT 2007 | rgduval

Dave, I've seen some instances of solder as you mentioned "painted" over the joint. Almost looks like a seam between the added solder and the originally waved on solder. Typically, I've seen that in the past from an incomplete solder joint. One w

No Clean Flux (Alpha OM5100) low level analog interference

Electronics Forum | Fri Apr 13 12:24:07 EDT 2007 | teamcanada

We assemble for a customer that is having an inconsistent low level analog interference we believe with the no clean flux residue from Alphas OM5100 solder paste. We are considering testing Amtechs 4300 water washable no clean paste. We will test bot


assemble searches for Companies, Equipment, Machines, Suppliers & Information