Electronics Forum | Wed Aug 19 16:01:47 EDT 2009 | davef
You say, "using Eutectic Solder." * There are lots of eutectic solders. * When melted, a eutectic solder goes directly from a solid to liquid phase with no pasty phase. Do you mean 63/37 tin lead solder? If so, probably your assembly won't be RoHS
Electronics Forum | Mon Aug 24 17:34:18 EDT 2009 | hegemon
DRS22 is not really comparable to the DRS25 due to a huge difference in the bottom heat technology used on those machines. If the PCBs are light enough the huge power of the DRS25 bottom heater is likely not needed, though. I would ask about your pr
Electronics Forum | Tue Sep 08 10:19:27 EDT 2009 | grics
Good Morning! I need some clarification. Our company is working with a start up company on some prototypes. On the bottom of the assembly they are placing a SOT23-5 component. It is being presented to the wave so the lead banks are parallel to the
Electronics Forum | Mon Sep 21 15:45:35 EDT 2009 | boardhouse
Hi Ryan, Standard shelf life for FR4 Non-RoHs & Rohs material with HASL or Lead Free HASL would be 12 months + in a controlled environment. on all RoHs materials over 6 months, we would suggest your board shop run a solder ability test before ship
Electronics Forum | Wed Sep 30 12:58:35 EDT 2009 | markhoch
I'm just throwing this out there, but is anybody manufacturing large footprint flex circuit PCBs? (I'm talking assemblies 18-36" in length) We're in the midst of quoting a new opportunity that involves several flex circuits of this size. Currently o
Electronics Forum | Sun Nov 01 01:33:52 EST 2009 | isd_jwendell
Just my opinion: Top pic - Solder mask registration WAY too far off, without a doubt I would reject. Bottom pic - I would worry that there was/is a contamination that caused the poor looking mask. This may be cosmetic only, but unknown. I would rej
Electronics Forum | Tue Nov 03 18:09:17 EST 2009 | gregoryyork
I think most have summed up the first pictures also is the drillng looking like it is misregistered as well. Better to do a solvent test to determine resist cure not the old stuff the newer chemicals show under cure problem much better. Try your st
Electronics Forum | Thu Nov 19 12:29:36 EST 2009 | mikesewell
Regarding more info on equipment - what you need is driven by your product and process requirements and tolerance for rework, labor amt, operator dependencies ..etc. EMPF offers a bootcamp for circuit card assembly, SMT mag publishes SMT 101 guide t
Electronics Forum | Tue Nov 17 22:36:17 EST 2009 | rajeshwara
Hi All Plz help , we are manufacturer of Set Top Boxes , where we use ST BGA 5202 ,Paste : ALPHA METAL OM338-T45-LF & STENCIL : 4 MIL & we also tried 5 mil . Problem : At first Test BGA work fine but after some days Assembly dead functional and when
Electronics Forum | Tue Nov 24 19:07:12 EST 2009 | gregoryyork
I agree Patrick many people blame the assembly fluxes when it is some other hygroscopic chemistry left on the bare PCB such as surfactents from the HASL process these will do exactly what the guy reported in his post fail then cool down and pass ever
