Electronics Forum | Fri Aug 13 07:26:06 EDT 1999 | Brian Conner
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Mon Aug 09 19:03:07 EDT 1999 | ScottM
| | Greetings, | | | | Would like to buy a 3 phase UPS for our Mydata TP11. | | Been looking and generally, sales person's point of view, 10KVA @ $10,000.00 is what they recommend. Seems a lot to me??? | | Called Mydata and suggested 2.2KVA per pha
Electronics Forum | Thu Aug 05 10:40:38 EDT 1999 | John Thorup
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually publishe
Electronics Forum | Wed Aug 04 17:32:52 EDT 1999 | Dave Weihrauch
| | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental cond
Electronics Forum | Mon Aug 02 18:52:57 EDT 1999 | Graham Naisbitt
| Very shortly I will be evaluating OA flux and aqueous cleaning to replace our RMA and solvent cleaning process. I am primarily interested in batch aqueous cleaners for reasons of budget, floor space, etc. I am concerned about the ability of H2O t
Electronics Forum | Thu Jul 29 00:23:45 EDT 1999 | ScottM
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Mon Jul 26 18:05:18 EDT 1999 | ScottM
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Fri Jul 23 13:34:07 EDT 1999 | Scott McKee
| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing
Electronics Forum | Fri Jul 23 14:17:55 EDT 1999 | Steve Schrader
| | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performin
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