Electronics Forum: assemblers (Page 336 of 598)

PCB Manufacturer (SMT Technology) should read this

Electronics Forum | Wed Jun 16 21:56:04 EDT 2004 | rodionp

For those who are not sure as to what exactly we do, please get familiar with the article: http://www.reed-electronics.com/semiconductor/index.asp?layout=article&articleid=CA71291&industryid=3026 Which is PCB Assembly Optimization, what we do is we

PCB Surface finish

Electronics Forum | Tue Jun 22 11:14:03 EDT 2004 | Steve Thomas

A very quick survey regarding PCB finishes for a lead-free process. What is the most popular PCB finish for lead-free soldering ? Who drives the selection of the finish, assembler or designer ? Are tin whiskers an issue for anyone ? I'm coming at th

Dispensing Paste for 0201-0402 uBGA devices?

Electronics Forum | Thu Jun 24 12:30:06 EDT 2004 | deonn

Thank you for your input Russ. I do understand the technical challenges that 0402-0201 present. As a matter of fact, I personally think it is a bad idea for these devices to even be processed using conventional assembly methods when the alternative

Flex circuits

Electronics Forum | Sat Jul 03 11:20:08 EDT 2004 | KEN

....not unique. But tough as hell! I build flex assemblies for a major P&P equipment manufacturer. Some are pure flex, most are ridgid flex. And of course, why put fiducials on the boards to help the process (why God, why me?) We use pallets and

Flex circuits

Electronics Forum | Tue Sep 14 04:28:36 EDT 2004 | Rob

Hi Dave, 3M� Spray 75 Repositionable 500 ml was the last we used due to a bright spark in purchasing, but production didn't get on with it too well. The only one that really gives us good consistant performance was the original 400ml Spraymount a

BGA bake out....

Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette

The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac

Flux Designations and Composition

Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef

You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve

Palladium silver surface finish

Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy

Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t

PCB Cleaning

Electronics Forum | Thu Jul 08 19:58:18 EDT 2004 | rtaft

Hello, I have been tasked with updating our PCB cleaning sytem, of which I know little about, and could really use some advice. We are a small company and we hand solder our electronics to IPC standards. Our electronics are mission critial communic

25 mil QFP soldering issue

Electronics Forum | Thu Jul 15 22:03:07 EDT 2004 | KEN

In no particular order: Will the failed joints wet when touched with an iron + flux? Is there flux surrounding the joint (post reflow). If no, you may be baking it out premateurely. Is this assembly wave soldered? Where is defect discovered in yo


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