Electronics Forum | Thu Jun 11 15:26:29 EDT 2009 | diamondmt
Hoss67, Instead of investing into a machine to coat these assemblies we (Diamond MT) are a coating house that can certianly meet your requirements as well as giving a vre competitive price. It would certainly save time and money trying to learn the s
Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289
This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i
Electronics Forum | Thu Jun 18 00:24:13 EDT 2009 | boardhouse
Hi Mr. Halsey, Please check out our Web site: http://www.activepcb.com We are a Low-Mid volume High mix / Higher tech facility out of Taiwan with High volume out of our China facility. Proto -Production out of Taiwan - All product shipped FOB:Dest
Electronics Forum | Sat Jun 27 10:10:23 EDT 2009 | ysutariya
I'm not in assembly, but I do know of a technology called Sipad if you are only looking to do small batches. They pre-apply the solderpaste to boards with a light adhesive, which allows you to hand-place components, even micro BGA's and fine-pitch Q
Electronics Forum | Wed Aug 05 23:02:09 EDT 2009 | mrduckmann2000
Help! We are havin issues installing the new Linear Tech LGA118's. We are installing 17 of these beast per assembly, the problem shorting? Any ideas? Linear Tech is usless, they blame heat, not a big enough reflow oven, moisture, part disty's...e
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Thu Aug 13 12:23:39 EDT 2009 | robhs
Thanks Dave. What you say makes complete sense. We ran a job a short while back in this way (though without bonding) and found we had a much higher than normal failure of the BGAs which I can only attribute to the secondary reflow. As I have only got
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Wed Aug 19 16:01:47 EDT 2009 | davef
You say, "using Eutectic Solder." * There are lots of eutectic solders. * When melted, a eutectic solder goes directly from a solid to liquid phase with no pasty phase. Do you mean 63/37 tin lead solder? If so, probably your assembly won't be RoHS
Electronics Forum | Mon Aug 24 17:34:18 EDT 2009 | hegemon
DRS22 is not really comparable to the DRS25 due to a huge difference in the bottom heat technology used on those machines. If the PCBs are light enough the huge power of the DRS25 bottom heater is likely not needed, though. I would ask about your pr
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