Electronics Forum: assembling (Page 206 of 598)

Touch-up and Inspection Process

Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj

The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i

Outsourcing costs

Electronics Forum | Wed Apr 06 00:36:32 EDT 2005 | vinitverma

Hi, Well said Grant! I guess this margin on the component procurement is the largest contributor in the overall margin for big EMS companies who have global component sourcing and hence very competitive pricing for the same! As regards conversion co

3 Zone Lead Free Ovens?

Electronics Forum | Tue Apr 05 09:27:49 EDT 2005 | russ

These sound like european machines, From what I can tell so far Lead Free capable ovens just mean that they have hotter heating elements, and blower fans that can take the additional heat supposedly. It does not appear to have anything to do with t

Black pad on BGA after removal

Electronics Forum | Thu May 05 12:31:27 EDT 2005 | russ

Not in this case, these BGAs were lead free and the profile used was for a lead part. I guess I will give you the whole story. These boards were sent to us from a customer to have the BGAs replaced for an unknown to us reason. We removed the parts

5DX

Electronics Forum | Mon Jul 18 16:58:31 EDT 2005 | Gpe. E

Hi everybody. I would like to know if any of you guys is using the HP5DX output processor from Assembly Expert to generate de .NDF files for the 5DX machines. I tried but I got a lot of errors because de configuration file for that processor needs

BGA SEM test

Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper

Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t

cleaning of no clean flux

Electronics Forum | Wed Aug 10 08:10:39 EDT 2005 | davef

Comments are: * Sounds like it's necessary to clean "heareous F381, F352 no clean solder paste" in your application. Consider a paste that may be better suited to your application. * If you're cleaning "low residue flux", consider using an organic ac

solder strength

Electronics Forum | Tue Sep 06 10:20:33 EDT 2005 | slthomas

I love these stories. At my previous employer we experienced intermittent failures on an audio microprocessor assembly being used on a *new* product. This board had numerous microprocessors and complex firmware aboard. They discovered one PLCC on

Need Advice on SMT Pick&Place Machines

Electronics Forum | Thu Nov 24 01:45:44 EST 2005 | pavel_murtishev

Good morning, My advice is to put two Topaz-Xii in line. Machine programming is rather easy (with PPS and GPP that AssemleOn offers), but final teaching on machine is strongly required. If you want to prepare programs fully offline you�ll have to pu

Lead free tin copper only

Electronics Forum | Wed Feb 08 04:08:35 EST 2006 | fctassembly

Hello Greg, I agree with you that the article in SMT Magazine should be studied very carefully as it contains many errors in respect to SN100C. The testing performed was a DOE and was not an optimized run. There is also a statement on dross generatio


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