Electronics Forum | Tue Oct 20 11:37:38 EDT 1998 | Stefan Witte
All SM machines pick components with a vacuum nozzle. Most likely the component is picked in the geometric center, which may not be the center of gravity ( SOT 23, SO 89 ). Any other pick position than the center may be taught upon requirement, but y
Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon
| I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma
Electronics Forum | Fri Sep 11 14:45:03 EDT 1998 | Earl Moon
| | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because t
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Mon Aug 03 12:38:02 EDT 1998 | Dave F
| I am trying to obtain information on the US Heatsink market.I am trying to establish the top ten manufacturers, current trends, market shares etc Would anyone know where I could obtain such information ? I would appreciate any form of help. | Best
Electronics Forum | Fri Jul 10 09:17:13 EDT 1998 | justin medernach
| There's a company out the that makes air sleds for moving equipment around. Air sleds are heavy duty plastic plastic bags with lots of little holes in the under-side. The bag is positioned under the equipment. A vacuum cleaner, hooked-up backwar
Electronics Forum | Wed Jun 24 18:41:23 EDT 1998 | Bill Chrisitian
| Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exactl
Electronics Forum | Thu Jun 25 11:53:09 EDT 1998 | Dave F
| | Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exac
Electronics Forum | Mon Jun 08 20:03:07 EDT 1998 | Dave F
| Chiakl | Ion Chromatography has been perfectly described by Dave, but here are a couple of extra considerations: | Ion Chromatography will tell you precisely what is present on the surface of your board/assembly but it will not tell you whether it
Electronics Forum | Sat May 30 18:09:17 EDT 1998 | Earl Moon
| Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | As everyone knows, IBM had problems with their ceramic BGA
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