Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol
Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask
Electronics Forum | Wed Oct 20 07:09:12 EDT 2004 | mattkehoe
Not really. Our process is a solid solder deposition application so we are not placing components into the wet paste prior to reflow. We print the paste then reflow is without components, trying to create a meniscus which is then washed, flattened,
Electronics Forum | Tue Nov 02 09:05:15 EST 2004 | russ
I have never experienced voids when using the flux only for application. Search the archives for void causes. As far as "more paste is better" I think that could be a true statement if we are talking about adapting to co-planarity type issues. My
Electronics Forum | Tue Nov 09 21:10:02 EST 2004 | davef
Some GD saleman [Oops, make that very nice saleman. He took me along for lunch.][Just kidding, all you sales types out there. You know how much I like to put burrs under your saddles. ;-) We kid because we care.] got into the catacombs to wake-up o
Electronics Forum | Wed Nov 10 15:18:15 EST 2004 | Dave G
Let's go for Ugly..... I've used these in the past for attaching connectors to boards and tabbed Transistors to extruded Aluminum heatsinks with mixed results. The concept is great but, in practice there are some headaches to deal with. We've gotten
Electronics Forum | Mon Jan 10 11:08:39 EST 2005 | mrgman9999
We are having a problem with popcorning of a plastic BGA that has been under careful humidity control. We have had problems in the past and some have been related to too much trapped internal solvents from the die attach epoxy. We did a life time b
Electronics Forum | Fri Feb 11 19:07:16 EST 2005 | primus
We are also looking for AOI machines, pre- and post-reflow. We already tried one machine from the UK (I don't remember the name, I perfer to forget we ever had it) and they told is it would do everything we wanted. Maybe so, but not well enough. It s
Electronics Forum | Wed Feb 02 08:51:25 EST 2005 | Dougs
we have a capacitor cracking on one of our boards, there are four of the same cap on the board and only one cracks, we are seeing about 6% of the component cracking. it's not near the edges of the board and he board is 2.4mm thick so i dont think it
Electronics Forum | Mon Mar 07 18:41:13 EST 2005 | jimmyb
--IE, Funny.--- I "remember" kinda, from the early CP6 years, things about the springs. The early Fuji springs had sharp ends, and if you spun the nozzle, prior to final attachment, the opposite way it could stick, and if it was spun the right way,
Electronics Forum | Fri Apr 01 01:26:17 EST 2005 | Marv
A couple of things.. 1) The problem is more than likely on the magazine board itself (TC2), most likely the pal chip that stores the serial number and feeder information (you could swap this with a working magazine to verify) 2) The magazine connecto
