Electronics Forum | Tue Oct 19 14:51:27 EDT 1999 | Kiet Dang
I'm trying to set up a SPC for a thermo compression beam lead attach process. We're using a west bonder thermo compression machine. I'd appreciate any input on temperature, pressure,tool, and critical process considerations. thanks, -kiet.
Electronics Forum | Tue May 19 12:59:13 EDT 1998 | Mike
| Does any one know how to attach a picture to one of these posts? If it is possible I will attach a picture of what it is I'm seeing. Yea Email Steve Greg, he is always putting wierd Pics in here, but I like em | Thanks | Richard
Electronics Forum | Mon Oct 15 11:27:48 EDT 2001 | rob_thomas
Hello all, Does anyone have any experience using solder quick preforms for ball attach on Flex? Thanks, Rob
Electronics Forum | Tue Nov 05 00:51:39 EST 2002 | yngwie
How to measure the max allowable force when we press the heatsink at the attachment process. I was posted with question by my customer, " how to I ensure that the force I use to attach the heatsink does not causing any damage to the solder joint on t
Electronics Forum | Sat May 08 01:42:13 EDT 2004 | smontiel
We have just been audited by our customer. One of the major finding was the thermocouple attachment. They insist that we use conductive epoxy to attach the thermocouple to the IC body and PCB surface. Any suggestion on what brand/model of conducti
Electronics Forum | Thu Aug 12 20:32:44 EDT 2004 | usdigital
Indy, We use Palladium silver surface finish parts for silver epoxy attached parts only. It is our understanding that this finish is not for solder, but only silver epoxy attach. I expect that is you problem. Dave
Electronics Forum | Sun Aug 01 11:27:40 EDT 2004 | haran
What is the best epoxy attachment method for Heat Sink?The operator always miss the solvent dispensing application prior to epoxy dispense which cause the heatsink falling off at customer site as well as in the factory?Any advise?
Electronics Forum | Fri Mar 18 11:26:02 EST 2005 | KEN
KIC Thermal Its on the web site (just root around) There is an excellent white paper on comparisons of the major attachment methods. Solder, kapton, epoxy etc. Cameron S. is the author.
Electronics Forum | Mon Apr 04 08:01:49 EDT 2005 | davef
Can you run one thermal cycle to attach the BGA and then a different thermal cycle to attach the connector?
Electronics Forum | Tue Aug 02 21:37:21 EDT 2005 | davef
Are we talking: * BGA that you've reballed and want to clean prior to attachment to a circuit board? * BGA that you've attached to a circuit board after correcting something or other? ... and we're talking a water soluble flux or what?
