Electronics Forum | Thu Feb 20 00:51:42 EST 2003 | Joe
We are running an RMA flux (Kester 1515). Changing the angle didn't help any so we're back at 6 degrees and placing an order for the lambda nozzle changeover. Are you currently running the debridging knife?
Electronics Forum | Thu Feb 20 14:06:41 EST 2003 | dgjjr
I went through EMPF's two week SMT boot camp a few years back. I got a lot of good info out of the course. They are in Philly right next to the airport so our travel expenses were reasonable.
Electronics Forum | Fri Feb 28 13:11:55 EST 2003 | russ
one more thing, have you checked out the ability to just hand solder by drag technique? This can be the fastest easiest way sometimes. Russ
Electronics Forum | Tue Mar 25 10:58:46 EST 2003 | davef
The best off-the-shelf option is: Go back to your customer and have them relay-out the board. This will: * Reduce labor costs. * Improve reliability by lowering the chance of package cracking caused by less than optimal lead forming.
Electronics Forum | Sun Mar 30 20:21:44 EST 2003 | iman
we are using a "recommend supplier profile", and we have gotten back to the talking table with them over this profile specs. Thanks for the pointer, have ask them on this issue. Have also asked for their phase-transistion diagram to understand their
Electronics Forum | Thu Apr 10 10:43:23 EDT 2003 | chrissieneale
Thanks for all the posts, i'm off on holiday for the next two weeks, but i know this problem will be around after i get back so hopefully i will be able to update you as to whether the board passes test or not!
Electronics Forum | Thu Apr 24 09:27:56 EDT 2003 | jgregory
What I meant is the gray rubber seals, top and bottom, that are pliable to allow the SS nozzle to slip back out and still provide sealing, deform too much and "squish" out to the sides. Jason
Electronics Forum | Thu May 15 11:50:19 EDT 2003 | mantis
we have seen something similar,at the edge,sof the Bga the tracks were shorted with some burr and excess gold. It was very hard to find but it was root caused back to the BGA manufacturing process.
Electronics Forum | Fri May 16 11:28:23 EDT 2003 | swagner
In agreeance with the previous postings I would like to add one more thing, in event of a automotive recall a lot of money can be saved by knowing which lot code is bad and tracing the data back to a specific group of vehicles instead of recalling se
Electronics Forum | Wed Jun 18 07:26:42 EDT 2003 | rmurtuza
Do BGA packages absorb moisture to a great extent if kept exposed to an atmosphere of 300C and 60% relative humidity overnight? Should they be backed before reuse. How long can they be kept exposed without the requirement of baking. Are there any spe
