Electronics Forum | Thu Mar 11 02:56:01 EST 2010 | grahamcooper22
Hi, blow holes / pin holes / holes in joints are usually a sign that there is excess moisture somewhere around the solder joint. Moisture can be in pcbs / components, so try drying them....a simple thing to do is pass a bare pcb throught your reflow
Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Fri May 15 10:41:12 EDT 1998 | Dave F
| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Mon Dec 16 15:10:56 EST 2002 | Randy Villeneuve
We do not bake any of our boards prior to wave solder. If we did we would have one heck of a large oven. I would assume you are concerned about moisture sensitive components. In most cases your top side parts should only get to 80 degrees centigarde
Electronics Forum | Thu Feb 05 15:38:21 EST 2004 | mrmaint
Pete C We do bake our tray parts. I am familiar with the ipc specs. The problem is for example: a level 4 component can only be out a total of 72 hrs before rebake is required. If this is a tube or reel part, the 125c bake temp that is recommended wi
Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid
TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s
Electronics Forum | Mon May 10 14:52:32 EDT 1999 | C.K.
| | | I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular overnight process
Electronics Forum | Thu Dec 19 11:30:11 EST 2002 | russ
What temp. are you planning on baking them? If this is long term process I would recommend that you hav trays made out of an appropriate ESDS material that can withstand your bake temp (such as duropol)for your QFPs. You can have several patterns/pa
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
