Electronics Forum: bake out (Page 26 of 40)

BGA PROCESS MATERIAL

Electronics Forum | Fri Feb 20 08:56:42 EST 2004 | davef

We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, because we cannot remove the flux residue from under them efficiently. Use ion chromatography testing to be sure it is clean under the BGA. IC is the on

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont

We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte

SMT LEDS SOLDERING

Electronics Forum | Mon Sep 15 17:38:57 EDT 2008 | bman

We've found that storage of other LEDs from this manufacturer can be very important. On page eight of the datesheet you attached, it says: "It is recommended that LEDs out of their original packaging are IR-reflowed within one week. For extended sto

Re: Dry Storage Options

Electronics Forum | Fri Jan 29 15:52:54 EST 1999 | Sarah Marshall

| I've had good luck with cabinets sold by Stanley Storage Systems (800-523-2449). This is a sturdy, steel cabinet (no windows) that is intended for nitrogen purge. It's less expensive than the specialty acrylic cabinets sold by other companies. W

Re: Dry Storage Options

Electronics Forum | Fri Jan 29 16:11:29 EST 1999 | Charles L. Morehouse

|I aggree with Sarah, I have found that Stanley sells a good configurable product for the money. | I've had good luck with cabinets sold by Stanley Storage Systems (800-523-2449). This is a sturdy, steel cabinet (no windows) that is intended for

Micro BGA baking

Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette

Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes

Baking for delam prevention

Electronics Forum | Wed Nov 16 18:44:54 EST 2005 | Mike F

A good board used soon after you receive it should not delam. If only a small percentage is doing that I urge you to do some more looking at the board quality while you do the baking. Do a search of the archives on baking boards, Dave F had some good

MSL/MSD Tracking

Electronics Forum | Thu Aug 21 16:33:49 EDT 2008 | decaire

The 2 most common approaches for MSD Tracking and Control on the factory floor are: 1) Manual paper-based procedures (Example: Log Sheet or Label that the operator must fill out and pay attention to) - or - 2) Software-based tracking system (Example

Moisture under chip capacitors

Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.

I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a

Re: BENT LEADS ON FINE PITCH

Electronics Forum | Wed Apr 14 17:25:01 EDT 1999 | Stephen Oltmann

A company in Santa Clara California specializes in repair of fine pitch using automated inspection and repair equipment. They guarantee their work and include bake and dry pack. Go to http://www.sixsigmaservices.com/services.htm | DOES ANY ONE KNOW


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