Electronics Forum: balling (Page 201 of 297)

Universal say what you will

Electronics Forum | Fri Jul 19 22:32:59 EDT 2002 | lysik

I am the first to bitch about OEM's. So I will tell you this. I ordered a part from Universal instruments that was made in 1979. They were happy to tell me it was in stock and they would ship it over night. That is the BALLS. not only did they have i

No Clean Selective Solder

Electronics Forum | Wed Jul 31 06:50:10 EDT 2002 | mzaboogie

We have recently implemented a selective solder process using no clean flux. We have experienced a problem with "micro solder balls" Some of them are not so "micro". The equipment manufacturer stated that this is a common problem with no clean select

No Clean Selective Solder

Electronics Forum | Thu Aug 01 07:36:03 EDT 2002 | pjc

Chris, OK, sounds like it may be more of an equipment problem: "The solder balls are randomly deposited along the path of the select wave,..." Does the equipment vendor have an applications engineering group to assist you? If not or are weak, try to

BGA void removal

Electronics Forum | Sat Oct 19 08:33:50 EDT 2002 | johnw

The whole thread seem's to have gone off track. Russ we've been doing a fairly big bit of work on the whole BGA voidign thing as we were so unhappy with the answer's that we were getting from around the industry, basically no one really kows all the

Cleaning Oxides from BGA's

Electronics Forum | Fri Oct 18 06:33:28 EDT 2002 | johnw

Here's one for you lot, dos anyone have a method or a vendor that can clean the ball's of BGA's of oxides to bring them back to 'new' conditions ? I've got a bathc of components that are fairly old and I get some issues with soldering them which I b

BGA dead bug pick and place

Electronics Forum | Fri Jun 18 11:31:17 EDT 2004 | gregp

I think it depends on the thickness of the PORON sheet. For .3mm balls you could probably get away with a pretty thin sheet (maybe 1/16"). I don't know how thin it comes offhand. For the part you are describing I woulf try maybe a 3.5mm OD and a 1

Stencil Printer comparison

Electronics Forum | Tue Nov 26 09:19:29 EST 2002 | pjc

MPM UltraPrint 2000 2D Inspection Times: QFP 256 pin 16Mil pitch is 7.5 seconds BGA 225 ball 20Mil pitch is 1.8 seconds Find out the DEK times for these devices. Any UP2000 of 1995 mfg. date oand on can be upgraded to the latest software. Concer

Help! BGA Socket / BGA Direct Placement

Electronics Forum | Mon Nov 11 13:46:43 EST 2002 | ksfacinelli

I have a interesting problem. I have a client that would like us to build 15-20 prototypes of a fairly complex design that contains a Enplas OTB-289-0.8 BGA socket. The problem I have is the customer does not have enough sockets and is asking if we

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 16 17:35:43 EST 2002 | davef

Jim Consider issuing a purchase order to your assembler for the purchase of selective wave soldering pallets required to solder your board. That way, you: * Own the pallets. * Can take the pallets with you should you decide that another assembler

Selective soldering pallets and solder balls

Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve

Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al


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