Electronics Forum | Thu Jul 09 13:04:19 EDT 1998 | Phil
I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help given
Electronics Forum | Fri May 22 16:14:45 EDT 1998 | Earl Moon
I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). Earl Moon
Electronics Forum | Sun May 31 16:00:33 EDT 1998 | Eric
Earl, I am not sure of your specifc application but we have a good system to easily reball your BGA's E-mail me at bgakit@concentric.net for more information. Thanks, Eric
Electronics Forum | Thu May 07 08:31:13 EDT 1998 | Alan Pestell
We are about to use BGAs on our equipment. We clean all products prior to confomally coating them - to keep moisture off the IC legs. Will this be a problem with BGAs. Will we need to get the coating underneath the BGA or will the pitch on the balls
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Fri Mar 27 19:53:06 EST 1998 | Tony Arteaga
If you still interested in information on BGA rework, please e-mail me. We currently provide BGA rework, from re-balling and placement of bga. Thanks Tony A
Electronics Forum | Tue Aug 07 20:53:14 EDT 2001 | davef
slowing-down the conveyor to allow the solder to heat these balls more. But that may not be the answer, because if the flux is exhausted, more heat will not help. Then if the flux is exhausted, the answer is to crank the belt. Two different answer
Electronics Forum | Wed Aug 15 01:46:43 EDT 2001 | Pavel
Hi, could any body tell me the reason for solder beads apperance and how to aliminate them (solder beads are solder balls that are found along chip body). Thanks,
Electronics Forum | Wed Aug 15 08:16:29 EDT 2001 | wbu
Hi Pavel, what you see is most probably caused by to much solder. There�re plenty of hints to avoid this in the archives, just use the "search" function and look for "solder beads" and "solder balls". That will bring you on the right track. Good lu
Electronics Forum | Wed Aug 22 09:17:15 EDT 2001 | steven
if do not have x-ray inspection machine, how to verify the 1st board out from the smt placer that the BGA is placed accurately onto the solder pads. the diameter of the solder ball is 1mm. could it self align during reflow?
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