Electronics Forum | Thu Feb 24 14:58:11 EST 2000 | Greg denham
Does anyone have any information on baking boards to remove moisture before reflowing and waving assemblies? I've been told that we should do this to stop such problems as delamination of boards, blow holes, solder balls, etc. I don't know have any e
Electronics Forum | Thu Feb 24 18:08:42 EST 2000 | Travis Slaughter
Baking boards, especially multi layer, will help with blowholes and delimitation, but not with solder balls. Normally about 120c for 1 hour or so is sufficient. I usually will not go to this trouble unless a board has proven to be a problem or if th
Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX
Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar
Electronics Forum | Thu Feb 15 07:25:05 EST 2001 | Nick
0.5um(Ni~6.5um) after reflow(data taken in 48hrs).But after performing temperature cycle test ,the former aging rate(from the shear strength ) seems faster than the latter.Why!?Someone call this the 'precipitation hardness',but what actually is it! A
Electronics Forum | Fri Mar 02 11:13:50 EST 2001 | fkurisu
Hello Mark, To date all solder mask rework we have done has been on the PCB board. I believe that it possible to reapply solder mask on to the ball side of the BGA. Would it possible to evaluate some of your BGA's? You can contact me at 714 842
Electronics Forum | Tue Mar 06 14:10:52 EST 2001 | CAL
Are the voids in the balls of a BGA? Are you verifying this through x-ray if they are? some voids depending on size and location are some what accepted. Solder paste type? Solder paste date code? Humidity high? PCB's been stored in a truck trailer?
Electronics Forum | Wed Mar 14 14:03:19 EST 2001 | mzaboogie
Hello, I have been told to look for open BGA connections, the open ball would appear larger than the others due to the fact that it has not columnized. I have also been told that it will look smaller due to the fact that it has not collapsed. Could
Electronics Forum | Tue Apr 17 21:30:27 EDT 2001 | davef
The issue is on the table. Which is it? Are you ... * Loosing your gold plate when you remove the tape? [A tape test is a standard test for evaluating gold fingers. Check IPC-TM-650, test number wachacallit. Checkitaut.] OR * Putting tape o
Electronics Forum | Thu Apr 26 07:16:38 EDT 2001 | wbu
Dave, nice movie !! Seems you�re expanding your already great services. It would be interesting what conditions lead to this phenomenon. To me it seems that one ball is blown up by voids extremely. Can you tell more about it ? Hope to see you at
Electronics Forum | Tue Oct 24 22:36:29 EDT 2000 | DL
On the main page of Smtnet towards the end of the opening paragraph states the following...Your " research continues in determining the reliability of thick film hybrid microcircuits and similar technologies using low-temperature, co-fired ceramics.
